Electronics Forum: stencil (Page 209 of 540)

Re: Laser Cut Stencils

Electronics Forum | Thu Apr 01 22:21:45 EST 1999 | Dave F

We make an excellent chem-etch stencil. Our customers have had success printing 16 mil pitch without a problem. This is not an advertisement! When we try to sell our product to new customers, we find more and more people willing to pay more fo

Re: Squeegee Speed

Electronics Forum | Tue Feb 23 09:51:35 EST 1999 | Steve Schrader

Hey all- My question is this: My stencil printer operator has said that he has to wipe our 6-mil stencil each pass to get the paste in the 20-mill pitch aperatures for a QFP to release well. We are using Amtech NC-559 type 3 paste with

Re: Print Height Variation

Electronics Forum | Thu Feb 11 09:45:06 EST 1999 | Dave F

Helo, Is it common for actual print height of solder paste to exceed the stencil thickness. For example If the stencil is 6mill thick and the actual height of the print is apx. 10 or 11mill. What causes the paste height to be greater t

Re: STENCILS

Electronics Forum | Mon Jun 29 13:51:29 EDT 1998 | Russ Miculich

WHAT SHOULD THE RATIO BE OF STENCIL APERATURE TO PAD TO GET GOOD QUALITY RESULTS. BY THAT I MEAN, A MINIMM OF SOLDER BALLS, AND LITTLE TO NO BRIDGING, SHORTS, ETC.. RIGHT NOW WE ARE USING A 1:1 RATIO, BUT ARE INVESTIGATING REDUCING THE APERATU

Re: STENCILS

Electronics Forum | Mon Jun 29 13:50:48 EDT 1998 | Russ Miculich

WHAT SHOULD THE RATIO BE OF STENCIL APERATURE TO PAD TO GET GOOD QUALITY RESULTS. BY THAT I MEAN, A MINIMM OF SOLDER BALLS, AND LITTLE TO NO BRIDGING, SHORTS, ETC.. RIGHT NOW WE ARE USING A 1:1 RATIO, BUT ARE INVESTIGATING REDUCING THE APERATU

Re: Any success using metal squeegees w/Fuji GSPII?

Electronics Forum | Fri Feb 20 14:16:06 EST 1998 | Dave McFadyen

I've been using metal blades on several brands of printers over the past few years and have to agree with comments in other replies. Contact print is a must or you will tear slits in your stencils at the ends of the blade. Center-mounted (floating) s

MPM Print Parameters

Electronics Forum | Wed Aug 15 18:48:58 EDT 2001 | mparker

I would consider the fab placement in the printer to be of more concern than the pro's and con's of a single foil for top and bottom print. Do to the larger size of the fab you will have to align the top and bottom layers sequentially on the foil. O

Fine pitch paste release problems.

Electronics Forum | Tue Dec 17 20:25:13 EST 2002 | iman

Check : 1) design aspect ratio / are ratio required to fabricate the stencil you r using. 2) check if the stencil maker is using your checked aspect ratio / area ratio? if not the same, what are they using? any QA report confirming actual dimension

Stencil cleaner

Electronics Forum | Wed Feb 26 13:15:52 EST 2003 | Mike Konrad

The specific answer depends on what your specific application includes. #1: What are you removing? (solder paste, adhesives) #2: What are you cleaning? (stencils, screens, misprints, pallets) #3: What type of machine are you using? (Spray-in

Naming Files

Electronics Forum | Tue Jul 01 18:36:06 EDT 2003 | Matt Kehoe

I am trying to get opinions about a situation that we are discussing with a vendor/customer. While not a technical issue it has caused some confusion and I need some opinions to help settle the debate. We are a service bureau who receives stencil fi


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