Electronics Forum | Fri Dec 01 14:40:02 EST 2017 | emeto
Very interesting pictures. It shows paste height of 200um - which is at lest 6mil stencil deposit. That on the other hand posts another question. Can you measure the ground pad level in relation to the solder mask level with the SPI? I had assemblies
Electronics Forum | Fri Dec 01 15:06:54 EST 2017 | emeto
I am not sure that is doable. Ground Aperture is very small(for the stencil blade to get in there) and very close to the other apertures. I want to say the minimum requirement for step is 6mm clearance from other apertures for the stencil houses that
Electronics Forum | Fri Dec 22 20:28:44 EST 2017 | 1232kade
Hi everybody. I have some problem that i cant solve, someone pls help me... My Mounter Juki FX-1R cant origin. When i try to origin, the problem appear ( see attach image ) I can control air devices like ATC plate, nozzle,... But cant origin and cont
Electronics Forum | Tue Jan 16 11:40:53 EST 2018 | awelektronik
Hello, i try to programm my vision system from our HS180 to place a Radio-Module (RN2483 from Microchip). On the Visionsystem, the Module are very bright! So i cant teach the leads from the module. I tryed to teach only measuring outline, but somet
Electronics Forum | Wed Aug 01 13:35:41 EDT 2018 | tey422
Need all your experts out there for tips & tricks to make things work. I been giving a task to help redesign a simple board; only to load two components. The challenge is to use pick-n-place machine to load the coil onto the 50up array panel. Previou
Electronics Forum | Fri Sep 28 02:48:46 EDT 2018 | teresat2
Principle A layer of photosensitive material (photosensitive oil or dry film) is applied to the copper foil on the board surface, and PCB manufacturer should be use the position is exposed by black film, This applies to most PCB factories, especially
Electronics Forum | Thu May 02 13:40:25 EDT 2019 | youngbuck
Hello All, I am having a issue with Siplace 80 F5 with parts placing of in the X direction after I do Zero Point Correction with tool and Full Calibration. I also do the Gantry Zero Point correction and parts still place off in the X about .200mm to
Electronics Forum | Tue May 28 18:31:08 EDT 2019 | jlawson
Solder paste flux is main contributor, Lead termination chemical-oxide by products and PCB Plating-Chemicals. Reflow profile would have very limited if not no impact really unless is way off. Paste volume control and Stencil design plays a big part
Electronics Forum | Wed May 15 05:44:04 EDT 2019 | peterchan
1、YSVJ-650B three-group multi- blades cutting machine, multiple sets of tools run at the same time, split the whole piece at one time, greatly improve production efficiency; multiple sets of tool design ensure that the split plate effect is not defor
Electronics Forum | Thu May 23 15:29:57 EDT 2019 | toms
Sorry for switching accounts, the SMTA interface was not giving me the option to add attachments. Evtimor - IC testing of some samples of different assemble holes and components leads did not yield anything abnormal. SEM EDX of the unsoldered lea
