Electronics Forum | Mon Dec 03 15:09:13 EST 2007 | realchunks
Eject-Eject-Eject!
Electronics Forum | Mon Dec 03 16:30:30 EST 2007 | slthomas
It's OK, I could quit if I wanted to. *bites palm*
Electronics Forum | Tue Nov 27 14:56:33 EST 2007 | jaimebc
Shy, What is your current method of applying adhesive? If the terminals of the component that has adhesive are not wetting ( or not forming a solder joint I think we are talking about ) after reflow, then you must be applying too much adhesive. As
Electronics Forum | Sun Nov 25 20:36:15 EST 2007 | shy
Hi Devaf, Sorry to make unclear statement earlier. I believe the issue that i'm trying to discuss is regarding the adhesive that place beneath (center) the component to prevent it from drop during wave soldering process. Normally the component pack
Electronics Forum | Mon Nov 26 13:09:20 EST 2007 | realchunks
Even a slight amount of epoxy will prevent a part from soldering. Look at the part after print. If you any trace of you epoxy between the pad and part, you have a potential problem.
Electronics Forum | Mon Nov 26 21:41:09 EST 2007 | davef
Shy: Oh, we NOW understand what you're asking. Sorry to be so dense. We agree that the standoff of component from the board could end-up being a little heigher than the pad height when using chipbonder adhesive. We rarely see a problem.
Electronics Forum | Tue Nov 27 04:50:45 EST 2007 | lococost
you say you use the glue to keep the components on during wave, why would you want to solder them twice, once in reflow and once in wave?
Electronics Forum | Tue Nov 27 07:27:58 EST 2007 | realchunks
I'm still confused. Why reflow solder a part when you're going to wave solder it? Seems like a waste of resources and material.
Electronics Forum | Tue Nov 27 07:44:59 EST 2007 | davef
We do not paste when we glue. We glue components so they will stay inplace during wave soldering. In wave soldering there is ample solder to bridge the standoff between the component and the pad.
Electronics Forum | Tue Nov 27 07:51:21 EST 2007 | shy
is there any gap between the pad and terminal if we place the glue? Btw, my practice to print solder pate then punch glue then PNP component and finally reflow. Also we find drop/missing chip after wave eventhough we glue the component.
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