Electronics Forum: electromigration (Page 3 of 6)

Fog Test

Electronics Forum | Fri Jul 26 17:02:07 EDT 2002 | davef

Never heard of flux residues forming a lense. The first thing that comes mind when thinking about your 'fog test' is: Ionic Contamination While this seems pretty far afield from your interest in optical effects, I'll continue briefly. A reverse

IONIC CLEANLINESS SPEC FOR BARE PWBs

Electronics Forum | Thu Dec 12 13:53:01 EST 2002 | gregoryyork

Considering only Ionic residues is very dangerous, most heat transfer fluids that are extremely hygroscopic are also non ionic especially those used in HASL / Roller Tinning fluids. Also consider if the resist is cured or in fact porous which absorbs

Electromigration Testing

Electronics Forum | Thu Aug 19 15:39:47 EDT 2004 | davef

This may sound dopey, but it may be the answer to your question. ROSE testers from different suppliers produce different results. Look at MIL-STD 2000. Based on Table VII, you find the following upper control limits (micrograms NaCl / sq. in.): * M

Electromigration Testing

Electronics Forum | Tue Aug 31 15:43:41 EDT 2004 | davef

You�re asking the wrong person to give remedial math lessons. Anyhow, here we go: * [1.56 microgram NaCl/cm^2]*[2.54 cm/in]*[2.54 cm/in] = 10.06 microgram NaCl/in^2 * [Omegameter] / [MIL-P-28809 Beckman / Markson] = [10.06 microgram NaCl/in^2] / [GS

Ion Contamination level allowed on Connectors

Electronics Forum | Sat Sep 25 03:44:38 EDT 2004 | GS

Thanks Davef, unfotunately in order to keep TIC of PBA inside our customer TIC requirements, we have to pre-wash (DI water only)connectors before assembly. Too high level of Br- continuosly get released by connectors molding compound. Our assemb

Reduce flux

Electronics Forum | Thu Jan 18 15:28:10 EST 2007 | CK the Flip

If you are, in fact, running a No-Clean solder paste: Different no-clean solder pastes will leave different types of (benign) residues. If your paste has been qualified from a Bellcore/SIR/Electromigration standpoint, any residues remaining will NO

solder joint failure analysis

Electronics Forum | Tue Feb 08 04:27:55 EST 2011 | thomas111

hi, I am a Hardware designer . One of my products is undergoing a Reliability test in which a resistor shows a high value on board from its specified value .However it retains the original value when its cooled under room temperature. The resistor

soldermask color change around vias

Electronics Forum | Fri Jun 07 11:19:14 EDT 2019 | gregoryyork

If you have soldered with HASL finish then the worrying chemistry will be more like NON IONIC. They sit there and attract moisture like mad and any chlorides they hold ionize in the moisture attracted and cause electromigration or SIR issues. They ca

Cracked MLCC's

Electronics Forum | Fri Aug 16 12:32:56 EDT 2019 | edhare

Steve, Yes, in my experience clients send in field failures (so latent failures) that exhibit internal shorts when a secondary fracture propagates from a knit line fracture. These eventually short due to electro-migration from plate-to-plate through

Electromigration Testing

Electronics Forum | Mon Jun 28 10:03:22 EDT 2004 | davef

First, welcome to your new job. Second, IPC-TM-650 2.6.14 is only loosely an �Ionic Contamination (Electromigration) Test�. * Electromigration Test, IPC TM 650 2.6.14, 2.6.14.1 * Ion Chromatography for Ionic Cleanliness, IPC TM 650 2.3.28 Third, I


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