Electronics Forum | Fri Jun 18 20:29:39 EDT 2004 | Ken
The problem is lead enrichment regions forming in the hottest part of the joint. The lead pool is the weakest part of the (SMT) joint. In TH interconnects hot tear or pad lift can result. I have recently seen this first hand.
Electronics Forum | Mon Dec 20 14:44:30 EST 2004 | JohnS
I had identical issue with CBGA's. I also found stress fractures at the sphere/substrate interconnect. The supplier had data to support their acceptability but we persisted and they reworked them,
Electronics Forum | Fri Apr 15 16:14:49 EDT 2005 | davef
Jim Zanolli of Teka Interconnect did an "OnBoard Forum" a couple of years ago [ http://www.smtnet.com/forums/index.cfm?CFApp=2&forum_idx=44 ]. He certainly would be a good point of contact.
Electronics Forum | Tue Dec 13 15:51:11 EST 2005 | Amol Kane
what part was this? was the high temp solder on the first level interconnect? why is the high lead solder being soldered with a SAC alloy?
Electronics Forum | Tue Dec 16 06:59:47 EST 2008 | janz
Hello, I am looking for technical papers (tips, tricks. machines, materials etc) for MID assembly (Moulded Interconnect Device - 3D assembly). Regards Janz
Electronics Forum | Thu Dec 17 03:20:32 EST 2009 | tod1967
Sounds like a good challenge. What is your interconnect bond method? Solder Paste, Pre-Form/Liquid Flux or Paste, Assuming your using solder. Reflow method?
Electronics Forum | Fri May 27 07:14:21 EDT 2011 | janz
Hello, I am looking for companies which supply AOI for 3D - MID substrates. (MID- moulded interconnect devices). Regards Janz
Electronics Forum | Mon Aug 15 18:42:53 EDT 2011 | bandjwet
Does anyone have experience in doing dye and pry analysis on PoPs? A customer wants to know whether or not the board level or device-device interconnect is the suspect. What other technique can anyone recommend? BWET
Electronics Forum | Tue Aug 16 09:37:58 EDT 2011 | blnorman
Dye and pry is frequently used on BGAs to determine if there is a crack at the board level or component level interconnect. C-SAM will show internal delaminations of components, not sure how well it would work with solder joint cracks. You can also
Electronics Forum | Sun Jun 12 09:29:41 EDT 2016 | davef
I'd guess that the interconnect pads on the BGA have poor solderability. Confirm this with testing at an independent lab. Work with your supplier to resolve the issue.
