Electronics Forum | Fri May 21 14:22:56 EDT 1999 | Dave F
| Dave, | i tried reflowing bare boards with only solder printed on em and no component placed. we still got voids as same as when components were placed. so atleast one of that theories(voids due to component/component placement)could be considered
Electronics Forum | Sat Jan 23 09:36:35 EST 1999 | Parvez Patel
Hi Everyone, We plan to build, for reliability/experimental/research purpose some CSPs (namely Tessera microBGA 46-I/O 0/75mm pitch and TI 64 I/O 0/8 mm pitch). the various factors that we plan to evaluate are the reliability and assembly concerns fo
Electronics Forum | Mon Mar 25 21:50:10 EST 2002 | davef
Some of this was copped from Fred. There are numerous package types that now fall under the rubric of land grid array [LGA]. Land grid devices [ie, Bumped Chip Carrier� [BCC], LGA, Quad Flat-pack No-lead [QFN], MicroLeadFrame�, etc] are essentially
Electronics Forum | Fri May 10 14:02:05 EDT 2002 | pjc
First off what bone-head designer put them there in the first place. Vias in solder lands is a big time no no. I had this problem at a CEM I worked at. I had the customer change the design but had to run the 6 samples they supplied. I ended up fillin
Electronics Forum | Wed May 07 09:21:46 EDT 2003 | davef
Here's some papers: * �Voiding Of Lead-Free Soldering At Microvia�; Dr. Hyoryoon Jo, B. Nieman, and Dr. N.C. Lee Indium Corporation of America; SMTA International; 09/22/2002 * �Solder Joint Formation With Sn-Ag-Cu And Sn-Pb Solder Balls And Pastes�;
Electronics Forum | Sat Nov 04 21:30:15 EST 2006 | Ola
Well, I can't tell you what the "glass wicking failure on PCB" are but for a standard FR4-pcb the Tg temp. or the so called glass temp. is 176 celcius degr. This means that the pcb is in between a firm and a buoyant condition. This is really a bit of
Electronics Forum | Sat Nov 11 11:27:51 EST 2006 | Tom
Hi, "glass wicking failure" we don't know what this is, but we suspect that the reflow process could very well be the root cause for some of our pcba with micro vias failure. Micro vias pcb we know to well (we don't like them at all). There are No p
Electronics Forum | Sat Nov 24 15:44:28 EST 2007 | mika
Hi DaveF, I had a short look into the Nr1. IMPACT OF MICROVIA-IN-PAD DESIGN ON VOID FORMATION Most interesting reading, but one thing though, I could not find any information about the oven profile. Just a picture of it. My question is of about the
Electronics Forum | Fri Sep 08 21:49:24 EDT 2017 | sbar5781
Hello, I have a few PCB boards i am trying to be manufactured that are miniaturized medical devices. Thus they require IPC Class 3 Specs. However as miniature devices they have limited space, including a 0.4mm pitch BGA socket, which currently has
Electronics Forum | Sat Jan 23 13:29:40 EST 1999 | Earl Moon
| Hi Everyone, | We plan to build, for reliability/experimental/research purpose some CSPs (namely Tessera microBGA 46-I/O 0/75mm pitch and TI 64 I/O 0/8 mm pitch). the various factors that we plan to evaluate are the reliability and assembly concern
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