Electronics Forum: stencil (Page 212 of 540)

Freshman in SMT industry needing advice

Electronics Forum | Mon Mar 29 18:17:48 EST 2004 | kerryn

It should be noted that some of the main reasons to change from manual cleaning to automated stencil cleaning are: � Manual cleaning is not consistent � quality is totally in the operators hands � Contamination left on the stencil and in the aperture

Re: Aperture sizes for printing SMD adhesive

Electronics Forum | Mon Feb 22 12:04:15 EST 1999 | Dave F

Please could you suggest a recommended aperture sizes for printing of smd adhesives. Any recommendations on stencil thickness as well as stencil finish will be appreciated. Mark: About the only rule of printing adhesives is: Keep it off the

Stencil cleaners.

Electronics Forum | Mon Jul 24 15:10:37 EDT 2006 | carln

Here are some additional comments that have been posted on the CircuitNet web site: Fist, the answer is the same regardless of the specific paste type, (leaded or non-leaded). High pressure sprays should never be applied to a stencil. Stencils are

DEK pro-flow

Electronics Forum | Fri Feb 16 09:30:38 EST 2007 | DEK Answer Guy

Hello PR, PumpPrint� technologies enable high throughput adhesive deposition using a screen printing platform. Careful selection of stencil material, and informed study of the design of apertures and other stencil features, enables a wide range of

Solder Pallet Maintenance?

Electronics Forum | Wed Jul 11 13:55:26 EDT 2007 | bschreiber

We have received several e-mails and phone calls regarding the Permali recommendation of cleaning Durostone pallets so I thought I would address these questions on the forum for everyone's benefit. Q: Can 440-R SMT Detergent be used for manual clean

Stencil Design

Electronics Forum | Wed Jun 03 22:07:41 EDT 2009 | davef

= 0.66 aperture opening to the stencil wall has been shown to provide the best transfer efficiency and repeatability of the deposited paste. Values from 0.66 to 0.8 insure a good paste release from the stencil. The biggest impact on area ratio is the

Squeege Snap off

Electronics Forum | Mon Jan 15 16:32:46 EST 2001 | Darby

Adrian, I'll go again. The term "snap off" on it's own refers to the distance between the bottom of the stencil and the top of the pcb. Sometimes referred to as "print gap". As you prefaced your question with "squeegee snap off" I thought you were as

Re: Accepting Stencils

Electronics Forum | Thu Nov 16 22:01:16 EST 2000 | Early Moon

I promised never to do this - BUT only for you needy folks when I have nothing else to do. And Dave's basically a good person though not as needy as most really needing this stuff. 1) Ensure internal Gerber data really matches board and stencil (Ger

Re: solder balling

Electronics Forum | Mon Aug 07 10:22:13 EDT 2000 | genglish

Ramon, I have had experience in the problems you are witnessing. The problem can relate to a number of factors. Obviously the printing process is the first place to start your investigations, try looking at the stencil apertures for bleed under the

Re: Soldermask Design Rules

Electronics Forum | Tue Jun 13 21:57:01 EDT 2000 | Dave F

Todd: You say: "... solder masking between the lands of fine pitch components can cause stenciling problems and or manufacturing problems." I say: Fine pitch components without solder masking between the lands can cause stenciling problems and o

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