Electronics Forum | Tue Dec 01 07:24:44 EST 1998 | Earl Moon
| Hi folks , | Lately we are seeing a lot of rawcards with black spots on the pads - most of them have Au finish(immersion gold) . We did a lot of inspecton after wave solder and found that only (fine pitch) QFP are affected the most. Our inspection
Electronics Forum | Tue Sep 22 12:25:31 EDT 1998 | Chrys
| | Hi Jacqueline! | | Do these joints that you're having problems with happen to be on fine pitch solder joints? Are the fillets staying attached to the foot and separating from the pads cleanly? | | If that is true, are there many vias concen
Electronics Forum | Tue Aug 25 17:49:15 EDT 1998 | Earl Moon
| Hello, | Our PWB supplier has requested that a change in the laminate material to reduce the incidence of pad lifting. The standard laminate materials (Polyclad PCL-FR-226 with a glass transition temperature of 135 C) have greater z-axis thermal e
Electronics Forum | Fri Aug 21 07:57:20 EDT 1998 | Earl Moon
| | | Will somebody please explain HASL (here). Thanks. | | Tryin: HASL: Hot Air Solder Leveled. A board fabrication process that applies an oxidation preventing solder coating to copper pads on the board. Dave F | You do this to keep the green s
Electronics Forum | Thu Aug 06 09:51:20 EDT 1998 | Bob Willis
This text may be of interest to any one with tin lead spots Guide to Solder Spots - A New Plague in Manufacture ? So what are solder spots ? They appear to be the next big problem in modern reflow assembly in fact in any process that involves solder
Electronics Forum | Tue May 19 05:42:36 EDT 1998 | Earl Moon
| Earl, | I admit that I missed your article since I seemed to have let my subscription to Circuit Fabrication Magazine expire. I am interested in your experience in this area. Is there a way to get a copy of your paper? Could you maybe post it to
Electronics Forum | Mon May 18 11:39:30 EDT 1998 | Earl Moon
| | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin package
Electronics Forum | Mon Mar 25 09:26:16 EST 2002 | stefwitt
you should also look into the different placement methods and their advantages and weaknesses. A chip shooter with a rotary head and lets say 18 nozzles always places one component and picks one at the same time. PC board and feeder table move while
Electronics Forum | Thu Nov 13 17:18:11 EST 2003 | davef
First, don�t get distracted by �OA� and �NC� formulations. This is nomenclature. We want to discuss the issue of �activity�. J-STD-004 "Requirements for Soldering Fluxes" classifies fluxes by their chemical composition, activity level and halide c
Electronics Forum | Wed Mar 16 06:46:59 EST 2005 | -=Verm=-
Hi lads long time no post... I have an issue with a PCB, its a PCI card that we manufacture for a customer of ours. The customer is seeing a problem with contact on a PCI card with the motherboard, the PCI card is removed from the board wiped and th
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