Electronics Forum: stencil (Page 213 of 541)

Re: Soldermask Design Rules

Electronics Forum | Tue Jun 13 21:57:01 EDT 2000 | Dave F

Todd: You say: "... solder masking between the lands of fine pitch components can cause stenciling problems and or manufacturing problems." I say: Fine pitch components without solder masking between the lands can cause stenciling problems and o

Re: MicroBGA printing problem

Electronics Forum | Wed Sep 22 21:23:03 EDT 1999 | se

I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. The stencil is 6 mil thick, laser cut and electo-polished. The apertures are 12 mil in diameter with 20 mil pitch. We

Re: MicroBGA printing problem

Electronics Forum | Thu Sep 23 12:47:48 EDT 1999 | Earl Moon

I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. The stencil is 6 mil thick, laser cut and electo-polished. The apertures are 12 mil in diameter with 20 mil pitch.

Re: Cleaning of 'No-Clean' paste

Electronics Forum | Tue Sep 07 12:33:03 EDT 1999 | Mike Konrad

You are correct in your assessment that no-clean pastes are difficult to clean. I understand why you would need to clean lots of stencils, but why would you need to clean "high volumes" of PCB's? If you are planning on cleaning high volumes of PCB'

Re: Semi-Automatic Stencil Printing of Fine Pitch

Electronics Forum | Thu Jul 15 14:09:23 EDT 1999 | MMurphy

I use a Transition Automation Semi- Automatic stencil printer with laser cut frameless stencils. My solder paste is an SN63/PB37 RMA 291. I do not operate with in a controlled humidity enviroment. The room temp generally runs around 70 deg's but

Re: Semi-Automatic Stencil Printing of Fine Pitch

Electronics Forum | Tue Jul 20 07:56:38 EDT 1999 | Mark Quealy

I use a Transition Automation Semi- Automatic stencil printer with laser cut frameless stencils. My solder paste is an SN63/PB37 RMA 291. I do not operate with in a controlled humidity enviroment. The room temp generally runs around 70 deg's bu

Re: uBGA

Electronics Forum | Mon Jul 12 14:30:37 EDT 1999 | Earl Moon

Hi all , We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: 1. Is underfill required for micro-BGAs? 2. What type of stencil apertures are the industry standards for uB

Re: uBGA

Electronics Forum | Tue Jul 13 13:28:18 EDT 1999 | Upinder Singh

Hi all , We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: 1. Is underfill required for micro-BGAs? 2. What type of stencil apertures are the industry st

Re: paste in hole

Electronics Forum | Fri Jun 25 16:32:45 EDT 1999 | MMurphy

hello, has anyone tried dispensing solder paste in thru holes instead of waving or hand soldering. if so how did it work out for you. thanks for the input wayne We have tried this mainly

Re: problem in micro-BGA assembly

Electronics Forum | Thu Jun 24 18:24:13 EDT 1999 | Christian N.

Dear guys, I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are now usin


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