Electronics Forum | Tue Feb 29 13:18:16 EST 2000 | Steve Schrader
We have what appears to be a recurring problem. On immersion gold boards only, we are having solderability problems. After reflow, selected parts can be popped right off the board. There is then a dark haze left on the pad. The paste on the compon
Electronics Forum | Mon Feb 28 19:36:39 EST 2000 | Tony
I work for a contract manufacture of PCB's, we are also in the BGA rework business. We see all kinds of different size boards, as well as different types of BGA's and micro BGA's. We selected the Conceptronics Freedom 2000 over the Air Vac and SRT. T
Electronics Forum | Tue Jan 16 18:00:50 EST 2001 | mikestringer
Hi everyone I am in the process of reviewing our storage of SMT components. At the moment they are pretty much on open shelves in the factory environment. We endevour to reseal components labled 'moisture sensitive' in their original packaging, bu
Electronics Forum | Mon Jan 17 02:40:17 EST 2000 | park kyung sam
Hi. smtman would someone answer me ? it's just the stuff pop ups without deep thinking. how much do our department spend money for 1 chip soldering. what should i consider ? i wonder i spend more money than other guys out there for 1 chip soldering i
Electronics Forum | Tue Dec 07 08:11:04 EST 1999 | Wolfgang Busko
Hi Russ, there�s something I don�t understand about the measures you took. I guess that TAL means time above liquidous and shortening of that time can result in bad dissolution of the protective Au-layer. The necessary time for the Au to mix with you
Electronics Forum | Fri Nov 05 21:29:56 EST 1999 | chartrain
No matter what type container you use, air in the delivery line will always be a problem. When you pop the lid on a pressurized container, fill it with a liquid and reseal it, air will be present over the liquid. Where do you think it goes?It has to
Electronics Forum | Mon Nov 01 22:16:20 EST 1999 | chartrain
Your problem is common on this solder defect. It is sometimes known as squeeze balls. The formation of these result from excess volumes of paste applied to the pads. Once the paste melts and covers the pad and component termination,the excess has no
Electronics Forum | Wed Oct 06 10:50:03 EDT 1999 | Wolfgang Busko
| Hopefully, everybody suffers from solderability of SOT-23 devices and I would like to know how everybody else resolves this problem. | Historically, here, we have always gone for 6 thou stencils. I found that going to an 8 thou stencil improved the
Electronics Forum | Thu Oct 07 18:30:22 EDT 1999 | jason gray
| | Hopefully, everybody suffers from solderability of SOT-23 devices and I would like to know how everybody else resolves this problem. | | Historically, here, we have always gone for 6 thou stencils. I found that going to an 8 thou stencil improved
Electronics Forum | Tue Jun 08 10:01:34 EDT 1999 | John Thorup
| Can anyone please help me locate details on maximum allowable temperatures of components when passing through a reflow oven. | | I think I want the thermal profile for the part, or a source or standard which will allow me to check if I can safely
