Electronics Forum: stencil (Page 216 of 541)

Re: Adhesive Dispenser Vs. Screen Printing Adhesives Pros and Cons

Electronics Forum | Thu Oct 12 11:08:20 EDT 2000 | Fraser

Dave, Why on earth would you want to use a stepped glue stencil?. If you print slightly off contact the hight of your glue deposition will be roughly half the width of your adhesive aperture width so if you want a 10mil high deposit use a 20 mil ape

Re: Capability Study for Solder Printing Process

Electronics Forum | Thu Sep 21 05:46:34 EDT 2000 | Wolfgang Busko

Once you know what your print should look like, means you have found the right apertures, stencil thickness, stencil finish and the right printer adjustments and alignments, the main things to watch for or better to control when printing is in progre

Re: S.P.O.T.T.

Electronics Forum | Tue Jun 11 14:58:45 EDT 2002 | Chris Lampron

Hello Sean, We are currently using a Pin in Paste process to mount some through hole relays. This particular board has 72 relays per. We have cut the stencil to overprint the hole. By putting a small amount of solder in the hole to flux the lead, th

via as test point

Electronics Forum | Mon Feb 26 12:26:43 EST 2001 | CAM

I'm working a problem and looking for your input. Here the deal: Two sided mix technology board. Test is using unmasked via points on bottom for test points. Our fab drawing states tent via points on top side. First set of board came in with no tenti

Need Expert Support

Electronics Forum | Tue Mar 13 17:26:07 EST 2001 | blair

1) We could press on BGAs and the boards would boot 2) This is basic boot up yield 3) We are now getting stpe by step inspection data going fwd. 4) So, Stencil design could be a critical factor. Any documented guidelines? 5) Yes DFX was done - mostl

Re: D-Pak misalignment Problem

Electronics Forum | Sat Dec 04 09:23:20 EST 1999 | Christopher Lampron

Kantesh, Does this particular part have a heat sink across the bottom side of the component and does your pad size and stencil aperture match the component? I have just had a very similar problem with a DPAK. What we found was that the recomended pad

Re: Info. on Stencil cleaners

Electronics Forum | Mon Nov 29 13:29:49 EST 1999 | Bill Schreiber

Dear Jason, We keep several published papers, written by industry experts, on our Web Site: www.smartsonic.com click on the "Recommended Reading" button. The Smart Sonic Stencil Cleaning Process is the only cleaning process that is Certified by

Re-Useable Stencil Frames

Electronics Forum | Thu Oct 21 21:26:19 EDT 1999 | Dave F

Yims: There's several threads in the archives on re-useable stencil frames, but they seem to be focused on a limited nubmer of suppliers. I'm trying to take a big picture of the suppliers of these frames. So I'd like to know about: 1 ITT ProFrame

Re: MicroBGA printing problem

Electronics Forum | Mon Sep 20 17:26:22 EDT 1999 | Earl Moon

I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. The stencil is 6 mil thick, laser cut and electo-polished. The apertures are 12 mil in diameter with 20 mil pitch. We are usi

Re: MicroBGA printing problem

Electronics Forum | Tue Sep 21 12:10:23 EDT 1999 | Mario

I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. The stencil is 6 mil thick, laser cut and electo-polished. The apertures are 12 mil in diameter with 20 mil pitch. We are usi


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