Electronics Forum: after (Page 217 of 696)

Through hole reliablility lead free

Electronics Forum | Tue Oct 17 03:13:10 EDT 2006 | charless

Apoligies Steve if I did not explain myself clearly. We have made the same design using the same RoHs compliant components (which I am assured by the suppliers are process temperature capable) with both lead and lead free solder. Without wishing to

RoHS Board Delamination

Electronics Forum | Tue Oct 24 15:46:09 EDT 2006 | aj

Mark, The pcb manufacturer recommended we bake the boards , so we did. I even weighed a batch before and after and seen slight decrease possibly 0.1g in weight. However we still seen some delam after all this. I am confident our issue has nothing to

High TG?

Electronics Forum | Tue Nov 14 04:52:57 EST 2006 | Loco

To make it even more compicated, you have CTE before Tg and after Tg, altough the after Tg is way more important, because the expantion ratio will be much bigger, a pcb supplier will usually give the before Tg value. To come back to the delamination

Fuji IP3 Head squealing

Electronics Forum | Mon Dec 18 21:23:13 EST 2006 | jgarver1

The spline shaft is bent. I have replaced a number of these over the years with the exact same symptoms. How is your placement? Your 180 degree placements should be skewed if the shaft is bent. 0 Degree placements are typically acceptable due to

glue dot size

Electronics Forum | Wed Dec 20 04:08:09 EST 2006 | ungun

Sorry for the late reply. I use glue dispenser machine juki kd-775. It have dispensing diameter confirmation unit, but dispensing test tape can be hold for 2 to 3 days a roll if the output 300 pcs pcb with average glue point 100 per peace. Beside, i

Copper Finishes versus Layer Thickness

Electronics Forum | Thu Jan 04 12:51:37 EST 2007 | Board House

Hi Chunks, Starting copper on outer layer with .0007 is 1/2 oz. copper foil. so if starting copper is .0007 and your Board house will plate an additional .0021 mils of copper. which will give you a finished copper weight of .0028 Mils or (2 oz.) Y

Solder Paste Inspection

Electronics Forum | Mon Feb 12 12:33:24 EST 2007 | SJ

There are several ways to inspect solder paste after deposition. Defects will range - too much paste, not enough, misaligned, bridged, smeared, etc. Some sceen printers have 2D inspection imbedded, otherwise a standalone system for paste inspection

Fuji IP-1 cycle alarm Z axis

Electronics Forum | Wed Jan 31 13:00:43 EST 2007 | bvdb

The continuing saga - we got the IP-1 communicating with the MCS16 again by replacing a couple of chips on the VME1152 CPU board and now it's working again but have a new problem. The machine stops about every other time when changing nozzles with a

EPROM OR OTP ICs issues

Electronics Forum | Fri Feb 09 13:05:14 EST 2007 | realchunks

Lawyer questions in the fact that they are silly or seem so vague? "1. Can X-Ray Inspection System damage the EPROM OR OTP during inspection after Reflow?" No, not by typical X-ray equipment designed for PCB manufacturing. "2. At 300 degree Ce

Storage

Electronics Forum | Tue Mar 20 04:13:53 EDT 2007 | chrissieneale

Guys, Unfortunately breakaways aren't an option - they are large boards and we already have problems hand placing components and probing them. The ridges - yes we can remove a few - and that solves one problem (boards bashing together and damaging


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