Electronics Forum: stencil (Page 219 of 540)

Rippling effect of stencils

Electronics Forum | Mon Feb 25 10:32:06 EST 2002 | cyber_wolf

Jeezuz... Darby is right. High Tech Squeegee blades are a crock of BS.Don't belive the hype. Its a big scam to rake in your dough. We use .008" thick spring steel stock from McMaster. There is only one thing:The blades must be dried off thoroughly af

Temporary Stencil for MPC555 PBGA

Electronics Forum | Fri May 31 03:45:54 EDT 2002 | robbied

The Flextac micro stencils I mentioned are not metal, but rather laser cut polymer, so not as easily damaged. As for cost, Even if you only re-use them 5 times and not the 10 that another company I know does, they only cost around �36 for a pack of t

Reflow PBGA

Electronics Forum | Wed Jun 26 21:41:46 EDT 2002 | ianchan

Hi mate, "no more than 6hrs in the stencil" for us means: 1) we finish setup of reflow oven, P&P m/c, and lastly the printing machine(includes loading of stencil into printer machine). 2) once printer machine is setup, we rip-open the paste Can pr

BGA rework stencils ( down to 0.65mm pitch)

Electronics Forum | Mon Oct 14 17:28:08 EDT 2002 | msimkin

Russ, Thanks for the feedback. Yeh, we are placing them in production using a full ball detect Yamaha placement machine, 5 thou square stencil. etc.etc. The only reason I raised this concern was from a rework point of veiw (actually, the board desi

SMD Adhesive Testing

Electronics Forum | Thu Dec 12 09:21:42 EST 2002 | blnorman

What we did: *Slump-dot diameter and height as a function of time *Print Speed-Vary speed, measure slump and missing/defects *Green Strength-We quantifiably measured tack vs time and we placed components and measure skew by SVS *Cure profile sensitiv

Fine pitch paste release problems.

Electronics Forum | Fri Dec 20 04:07:25 EST 2002 | Roger

Although everything that has been said earlier is sound advice for achieving good printing results, I strongly believe your problem is your manual printer and its inability to accurately control the speed at which the PCB separates from the stencil a

Stenciling chipbonder.....

Electronics Forum | Wed Jan 22 16:17:27 EST 2003 | slthomas

Ya know, I got that thing because I was told, once upon a time, that besides some typical low density passive bottom sided stuff, we'd eventually be building products with SOJ's and QFP240's on both sides and short of hand dispensing big tall gobs of

MPM AccuFlex

Electronics Forum | Tue Mar 25 08:35:49 EST 2003 | pjc

AccuFlex is the replacement for UltraPrint 1500. UP1500 is going obsolete. AccuFlex was desgigned for fast setup and changeovers and takes some tasks away from the operator. The UltraPrint 2000 was designed for high production, even though many users

16 mil pitch QFPs / solder paste type 4 & 5?

Electronics Forum | Mon Apr 07 12:21:02 EDT 2003 | davef

Russ is correct. A 5 thou thick stencil should give good release. Here's how you run through it: * You want at least 5 solder particles across the smallest aperture. So in your case, 8 thou wide, which equals to 0.20mm gives us 0.20/5=40 microns.

Screen washing

Electronics Forum | Wed Aug 27 00:45:35 EDT 2003 | kenBliss

Bman Each area and process has a unique machine for a reason. Professional engineers at the various OEM�s have thought these things through and there are specific reasons why you don't wash stencils in a board washer, bake pizzas in your reflow ove

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