Electronics Forum | Wed Mar 26 22:32:02 EST 2003 | dlkearns1
Have you seen or heard of Fouth Shift MRP or Avante MRP? I've used both of these. In my opinion, not good for a small company, and can be expensive, REAL big $$$ to implement. 4thshift and Avante MRP systems are NOT a do it yourself kinda package. S
Electronics Forum | Mon Mar 31 01:20:42 EST 2003 | Bryan Sheh
I agree that we should bake the pcb at higher temp and for longer time.for example...95--115c for at least 4 hours. also,keep the temp from 150--170c ,60-90 seconds while preheating. completely keep the moisture and volitales out of pcb and solder pa
Electronics Forum | Thu Apr 03 11:57:38 EST 2003 | davef
R4: We see the ball left on the PCB with a flat top and the BGA pad appears to be virgin. D4: Not good. The flat top indicates that the ball melted at one time or another. This pad and ball have seen at least two solder cycles with solder and flux. S
Electronics Forum | Mon Apr 07 13:02:30 EDT 2003 | kmorris
Sorry, I forgot to include the stencil thickness. It is 5 mil. Thanks for the input, everbody. I just checked with our stencil supplier & I thought that Electro-polish was standard with lazer, but I now find out it is not. Our stencil did not get
Electronics Forum | Wed Apr 09 10:17:28 EDT 2003 | ksfacinelli
http://picturecenter.kodak.com/share?invite=ZExr4tzrmmYeI5Uozhlo Here is a link to the pictures. This is a HASL board with ws-609 paste. Lead parts look good but would like to see a shinner joint in the BGA area. Thermal profile looks good 150-15
Electronics Forum | Thu Apr 10 10:54:34 EDT 2003 | pjc
It will vary by placement machine mfg. and type. I had 4x Fuji CP3 (turret chip-shooter) and 2x Fuji IP2 (split axis general app-fine-pitch)and tracked component shrinkage at 0.05%-0.5% on average. Above 0.5% triggered maint. & process eng. response.
Electronics Forum | Tue Apr 22 11:02:42 EDT 2003 | k_h
I'll throw this out there also: http://picturecenter.kodak.com/share?invite=HE2r4mzhP5YLJkvkhU1o It shows void slots (purple) in the copper on the perimeter of the smaller transistors heat sink. Should keep the smaller transistor from moving while th
Electronics Forum | Fri May 02 09:49:19 EDT 2003 | tommyg_fla
3NaH2PO3 + H2SO4 + 2H2 + Ni^0 Potassium is co-deposited with the nickel, as follows: H2PO2^- + Hads => H2O + OH^- + P 3H2PO2^- + P => H2PO3^- + H2O + 2OH^- What is Hads?
Electronics Forum | Fri May 30 18:30:32 EDT 2003 | russ
Okay, Okay, I will convert to the metric system. I would still rather say 1 mm instead of 10 microns. As far as paste how about "really little" and "really really little" (type 3 and 4 respectively) This term (micron)is good for people unlike me t
Electronics Forum | Tue Jun 03 21:50:57 EDT 2003 | yukim
A question regarding the rampup slop: as we cannot make the preheat time long enough due to our reflow oven limits, a Loctite technician suggested we increase the rampup slope, between the initial point (25C) and 80C, to 4C/sec, as between these temp
