Electronics Forum: plating (Page 220 of 260)

Re: Solder Wetting

Electronics Forum | Tue Dec 14 17:02:04 EST 1999 | John Thorup

Hello Kris If you do have and OSP coating I'd say Curtis has nailed it. But you seem to have references to gold. Does this board have a standard nickle/gold finish. If so what sort of "solder on gold" problems were you having? Reading between the

Re: Solder Balling Beading Effect

Electronics Forum | Thu Dec 16 06:59:43 EST 1999 | Christopher Lampron

Calvin, We have found several reasons for solder beading occurance. We have found that solder balling is usually directly attributed to the reflow profile while solder beading is usually (but not always) a result of either excessive solder paste volu

Re: Need advise on regarding Vias

Electronics Forum | Tue Dec 14 01:05:09 EST 1999 | cklau

Hi All I have a 0.7 mm diameter hole for vias, what�s the minimum annular ring for this hole diameter? Ans: Fur inner layers Min = .006" hole-pad annular ring ; inner pad dia - hole dia/2 For outer layers Min = .005" hole-pad annular ring ; outer p

Re: Noclean soldering to gold

Electronics Forum | Mon Dec 06 03:54:57 EST 1999 | Chris May

Hi Russ, I have a similar situation. I have been told that this can be caused by the nickel, over which the gold is plated, can result in suspect joints, embrittlement etc. Some joints can even be weak and broken without much force on some of my boa

Re: Via Sizes

Electronics Forum | Thu Nov 25 21:43:49 EST 1999 | cklau

Via is normally a plated thru holes in (0.63 to 1.0 mm (0.025" to 0.040") diameter lands , which unless properly treated they must be located away from the component lands to prevent the solder migration off the component land during reflow soldering

Re: copper land delamination

Electronics Forum | Mon Nov 15 21:35:50 EST 1999 | Dave F

Bob Bob: Fortunately, you found this before you built-up a lot of product. Some thoughs and other drivel: 1 Use IPC-TM-650, Method 2.4.8 for copper peel with a Instron machine. Typical pad peel strength requirement for FR-4, 2 oz. copper is: 6 l

Re: Dull Solder

Electronics Forum | Fri Nov 12 10:00:42 EST 1999 | Dave F

Edmund, following-on from Wolfy: Back in the old days, anyone who could spell "sodder" considered "bright and shiny connections" GOOD and "dull and grainy connections" BAD. Now, "dull and grainy" connections can be either GOOD or BAD, depending on

Re: ESD mats

Electronics Forum | Wed Oct 27 17:27:58 EDT 1999 | John Thorup

well... it might be cheaper. But I think it's a bad idea. First, your operators will hate you by the end of the day with their sore feet, not to mention lost productivity. Second, safety. Even if the plates are connected to ground through a resistor

Re: 0402's Tombstoning

Electronics Forum | Thu Oct 14 18:02:31 EDT 1999 | JohnW

Bryan, 0402's tombstonning isn't that uncommon and usually the 1st reaction is alway's the pad size aint right. If you've followed the IPC guidline's normally you should be fine but I'd double check the component supplier's spec's as well. brian's p

Help! 2-layered Thru-Hole PCB Solder Mask/Soldering Problem

Electronics Forum | Wed Sep 29 23:54:07 EDT 1999 | Dreamsniper

Hi everyone, Greetings! I�ve got a 2-layered through-hole PCB�s having the following problems: Solder Mask peels after wave soldering at random locations and only at the bootom side of the PCB Insufficient Solder and some solder never make it to t


plating searches for Companies, Equipment, Machines, Suppliers & Information