Electronics Forum: stencil (Page 222 of 541)

Kester paste problems

Electronics Forum | Thu May 24 19:27:50 EDT 2007 | kevinjm

We have a similiar problem with kester em907, a pb free paste. You say that your AOI system picks up blocked apertures, do you mean that the printers own camera looks at the stencil and sees apertures blocked? Or, is it picking up insufficient paste

Small board washer needed

Electronics Forum | Thu Jul 26 13:08:59 EDT 2007 | Mike Konrad

The best method of cleaning misprinted boards is with a stencil cleaner. I would not recommend the use of a spray-in-air system for misprints. Spray systems can cause solder paste to become embedded into vias and under components (if double sided).

QFP area solder paste shifted

Electronics Forum | Tue Sep 18 19:32:49 EDT 2007 | davef

Welcome Jimmy Let's mince words to help focus on the issues. When you say "QFP area solder paste shifted," do you mean: * Paste printed on land pattern perfectly, but moves after printing. * Paste printed off the land pattern, even though the stenci

PB and PB Free on same screen printer

Electronics Forum | Wed Oct 10 14:21:04 EDT 2007 | petep

We have done the Green Framed Stencils for an added $50.00 per, then got smart and went to green polyester on RoHS / Lead Free Stencils at no added cost. Dedicated Stencil blades and holders green of course) as well as Green Static mats on dedicated

Small batch Manufacturing

Electronics Forum | Mon Dec 17 06:48:05 EST 2007 | andy1975

Hi all Just found this forum and spent the last three hours reading your posts! I'm considering investing in a budget smt production line, and this is why: The company I work for manufacture very very small batches of boards, four a month for one p

Bridging Problems

Electronics Forum | Wed Mar 12 13:41:23 EDT 2008 | swag

We have a lead free assembly with a 128-Pin PQFP with 20 mil pitch leads. We have tried stencil aperture reductions, step-down stencils, different thickness stencils, various printer setting changes, placement pressure changes, nozzle changes, moved

Stencil design (maybe old) question...

Electronics Forum | Wed Feb 04 10:01:55 EST 2009 | dcell_1t

Hi there, We're developing a DOE where stencil design (aperture design) is going to be evaluated, currently we have regular reduction on sides, home base (triangular and semi-circle), "C" or "U" shape, and an idea for oval shape for pasives also cam

Printing SEMTECH SLP2710P8 8-pin package

Electronics Forum | Fri Aug 07 07:55:30 EDT 2009 | robhs

Hi. We are planning a production run of a board that utilises the SEMTECH SLP2710P8 8-pin device (2.7 x 1.0 x 0.58mm). The part orientation on the board necessitates that the squeegee print direction approaches the stencil apertures on the long side

Glue

Electronics Forum | Mon Sep 21 22:25:05 EDT 2009 | davef

What babies!!!! Sure, give it a try. * Stencil material: metal or plastic, no difference in print, metal is easier to clean, no static problem, available * Stencil thickness: Chips 0.006", SOIC 0.010" [print height equals 1/3 thickness] * For 0603, a

printing speed - paste vs. glue

Electronics Forum | Fri Oct 09 06:32:38 EDT 2009 | davef

Here's what is on that post referred to, not sure what you need more than ... "* Stencil material: metal or plastic, no difference in print, metal is easier to clean, no static problem, available * Stencil thickness: Chips 0.006", SOIC 0.010" [print


stencil searches for Companies, Equipment, Machines, Suppliers & Information