Electronics Forum | Thu Sep 07 08:45:02 EDT 2017 | dleeper
In my experience with similar sized parts, the nano coatings (or what ever your supplier might call them) do help with repeatable paste release. How are you cleaning your stencils? A big red flag to me is that your stencil worked fine for the first
Electronics Forum | Mon Oct 09 15:03:08 EDT 2017 | emeto
From what I know from people using it - it is a great machine. Allows you to have unique shape and amount of paste for every single pad. Great for small volumes, prototyping series and a great replacement for step stencils and any other occasions, wh
Electronics Forum | Fri Dec 01 13:55:44 EST 2017 | emeto
Brikainis, it looks like these vias are not plated and closed. I would say that thickness of your paste is lifting the part. Are you willing to try another stencil with ground pad apertures matching the via holes? It is probably worth trying. Anothe
Electronics Forum | Sun Jan 07 07:40:31 EST 2018 | mohammad
Hi everybody. I'm new at SMT soldering. I'm using a stencil to print solder paste on PCB. and my board has 0402 components that it make assembling process long so I can't complete a set of board in a day and I have to continue in the next day. what
Electronics Forum | Fri Feb 16 01:59:18 EST 2018 | ameenullakhan
Hi Dave, Thank you. I have been through IPC 7525A. But our boards bit more complicated and quality requirements are very stringent. 7525A doesn't help for much extent. Any other you have gone through and found to be very good to understand and lear
Electronics Forum | Fri Apr 20 03:04:24 EDT 2018 | tsvetan
We usually replace stencil when we start to get problems with the solder paste printing i.e. uneven solder paste deposit etc. Until then it doesn't matter how many years ago it's manufactured, but how many prints it passes and if the operators didn't
Electronics Forum | Fri Aug 24 13:21:59 EDT 2018 | babe7362000
What do others use as far as solder paste type, stencil thickness and aperature size for a .4mm Ball Pitch CSP. Ball diameter is .3mm. Please let me know your thoughts or what you use. Thanks
Electronics Forum | Wed Aug 29 03:16:20 EDT 2018 | cannizzaro
It is recommended that the thickness of the stencil of 0.1mm, the steel mesh should be partially nano-coated. It is best not to dry easily, and the particles are not easy to be too large. I have tried ALLPCB for this kind of BGA in the past and they
Electronics Forum | Thu Sep 06 03:43:00 EDT 2018 | cmchoue
Dear Experts, Have any paper or data talking about the design guideline for avoiding BGA solder bridge? I desire to know the rule(guideline)that compare difference stencil thickness and safe solder design distance (air gap) can avoid bridge.
Electronics Forum | Wed Apr 10 03:49:53 EDT 2019 | oxygensmd
GC CAM or Circuit CAM. Circuit CAM have been designed for stencil redesigning. Easy to use for.As I heard FAB3000 can be a good option. https://www.graphicode.com/GC-PowerPlace https://www.circuitcam.com/ https://www.numericalinnovations.com/collec
