Electronics Forum | Thu Sep 06 03:43:00 EDT 2018 | cmchoue
Dear Experts, Have any paper or data talking about the design guideline for avoiding BGA solder bridge? I desire to know the rule(guideline)that compare difference stencil thickness and safe solder design distance (air gap) can avoid bridge.
Electronics Forum | Wed Apr 10 03:49:53 EDT 2019 | oxygensmd
GC CAM or Circuit CAM. Circuit CAM have been designed for stencil redesigning. Easy to use for.As I heard FAB3000 can be a good option. https://www.graphicode.com/GC-PowerPlace https://www.circuitcam.com/ https://www.numericalinnovations.com/collec
Electronics Forum | Fri Jan 03 10:32:42 EST 2020 | emeto
Zack, circles 36mil copper 35mil circle stencil aperture. Pitch is 80mil. Stencil is 5mil and apertures are spread 46mm under the 50mm component size. In my mind this might be too much paste. I am afraid that if I print 4mil I might get open joints
Electronics Forum | Fri Jan 10 03:57:37 EST 2020 | jakapratama
Hello, When I calculate based on the data you gave, your stencil aperture area compared to pad area is 94.52%. Your aperture area ratio is 1.76 using 5 mils thickness foil. OK, your stencil and your paste release is not the culprit here. Your proble
Electronics Forum | Tue Jan 21 08:49:42 EST 2020 | emeto
I am sure you can upgrade it with DEK and it should not be so expensive. You can also ask them the price of the auto system. This is an arm(controlled by cylinder I think) and software to control it. This one moves the stencil in place when you load
Electronics Forum | Tue Jan 28 10:05:51 EST 2020 | dontfeedphils
What sort of foils are you talking about? Handling VG stencils isn't exactly tough, they're a bit more flexible than standard tube frame, but nothing horrible. Pair it with a good storage solution and you're set. I'm able to store 165 stencils i
Electronics Forum | Wed Jun 17 05:41:04 EDT 2020 | SMTA-Davandran
I have one product which only need print low temperature solder paste on OSP pad. This pad will used for hot bar process. Desired solder paste thickness is 0.10 mm to 0.15 mm. Is any one can advise right stencil thickness and aperture opening for it.
Electronics Forum | Fri Sep 11 00:56:44 EDT 2020 | rsatmech
Thanks for your inputs. Soak - 120 to 180 at average 110sec Paste - Senju - S70G - Type 5 (also suspect paste chemistry yet it's customer defined I can't do anything about this) N2 - maintaining O2 PPM at 1000 Stencil - planning to reduce the stenci
Electronics Forum | Fri Jun 04 17:44:20 EDT 2021 | dwl
The hardest part was convincing management of the need for a stencil cleaner in the first place. Cleaning by hand using IPA and a lint free cloth just leads to clogged apertures and print defects. BTW, lint free cloths leave behind a lot of lint.
Electronics Forum | Thu Oct 14 18:23:40 EDT 2021 | mikeybinec
OK, thanks for access a few decades ago when I was a kid, I printed soldermask and legend inks on circuit boards. Printing solder mask, (PC-401, SR1000, LPI) I would use SM-1000 stencil material on 86 or 110 mesh I've been trying to find sm-1000 bu
