Electronics Forum | Wed Feb 26 04:28:39 EST 2014 | chongns
Hi All member I have a problem on the stable down the color of the white solder mask PCB. first, i tough the color differences was cause by the solder mask ink, but after a close look, the color change are cause by the copper under the solder mask
Electronics Forum | Tue Apr 29 16:26:59 EDT 2014 | hegemon
Our facility is 5 years in the current configuration. We are in 75K sq/ft and went with glued down fully conductive tile throughout the factory. Looks great after 5 years, and we have a lot of traffic. In this setup, those same high traffic area
Electronics Forum | Thu Nov 13 10:05:18 EST 2014 | grimus
Hello, I'm fighting with problems of random solder balls that appears after reflow soldering around Pin in Paste component. I'm mounting this component with Pick and Place machine. I'm using solder paste type-3 and this is lead free product. This is
Electronics Forum | Thu Dec 04 10:59:02 EST 2014 | rrosera
HI, I work for a company in New England and recently had a unusually large number of boards fail after replacing a BGA on them. We use a AirVac DRS25 to remove and replace the BGA witch uses local forced hot air. We usually have at least a 90% s
Electronics Forum | Fri Jan 16 16:34:01 EST 2015 | rgduval
It's a four-spindle head. I've already learned the joys of the size of the nozzles...on a job that had an 0603 cap a bit too close to an SOIC. The first panel ran, and the cap placed after the IC...and I had parts everywhere. Got it figured out an
Electronics Forum | Mon Feb 09 09:00:17 EST 2015 | jax
Outside the MSD issues stated already (and I cannot provide a exact time not knowing multiple factors like Humidity levels, temps, exposure times, etc...) OSP might be the very worst finish to use in this scenario of side 1 / store on a shelf / side
Electronics Forum | Mon Mar 02 23:48:22 EST 2015 | vb7007
Hi We are using Universal carrier for a 2 sided PCB, where the bottom side goes for hand solder the switches after wave. Our issue is, we are getting micro solder balls all over PCB bottom after wave, whereas we got numerous vias, which also turns
Electronics Forum | Mon Aug 03 07:45:49 EDT 2015 | buckcho
Hello, I can give you some information: 1. After uploading of the gerber you have to go to the firs point from where you have to measure and pres "S" if you want the center automatically. After that pres the "zero user" button so you can null there.
Electronics Forum | Wed Mar 01 02:10:05 EST 2017 | soldertraining
Hi! I am Bob and pls forgive me if technical words I use are wrong. What may cause the BGA solder pad lift before or after reball? I am having problems where solder pad lifted during removal of bad solder ball. It also occurred during reball, where t
Electronics Forum | Thu Jul 07 11:52:25 EDT 2016 | proceng1
We just pulled a Speedline Accuflex printer out of storage. After programming a board and stencil, and calibrating the fiducials and everything, we do a test alignment and bring the board to print height. It is off. I've done it now with two diffe
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