Electronics Forum | Wed Jun 24 16:23:29 EDT 1998 | Justin Medernach
| Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | Mike Mike, Your concer
Electronics Forum | Fri Apr 24 23:03:28 EDT 1998 | Mikec
| I inherited a DI system that's um...not in good shape. | I would be forever indebted to anyone who could help me | with several problems related to this. | Flow rate 3.5-5GPM | Incoming pressure:50PSI | Application: deionized water provided to Elec
Electronics Forum | Tue Apr 21 12:48:41 EDT 1998 | Derek Drabenstadt
| I would like to know something about Siemens machines from users of Siplace or old machines. | Thanks ! I have been working in a shop with 80-S and 80-F machines for two years. The down time we have experienced is significant. Up to 25%.
Electronics Forum | Fri Oct 05 07:46:24 EDT 2001 | george
Specifications of testing force are not fixed, but (incase of wave soldering) the value should be at least 120-150 % of the force the wave. So for small chip components we assume that the force from the wave on the component is about 3 Newton, this m
Electronics Forum | Mon Nov 05 20:34:03 EST 2001 | davef
What�s the problem? There area many heat related failure mechanisms in bare boards. You can damage boards with heat several ways. A couple favorites [Don�t try this at home. Perform on a closed track by professional solders only.] are: * Put a
Electronics Forum | Wed Jan 30 17:44:38 EST 2002 | davef
The gold is compatible with your solder. Gold will dissolve in your solder very quickly. Assuming you have a fairly large [~ couple hundred pounds] solder pot, the gold will not, over the short term, affect the performance of the pot. The issue is
Electronics Forum | Tue Feb 26 10:55:58 EST 2002 | davef
This could be an electroless nickel / immersion gold specification. While the symmetry of the numbers is pleasing to the eye, but as Joyce Marchand says, "It doesn't blow-up my skirts." Problems with your specification are: * Lower end of the gold
Electronics Forum | Fri May 24 11:49:55 EDT 2002 | stefwitt
Again, I would like to refer to the tape dimensions and their deviations. In an 8 mm tape the distance from the sprocket holes to the tape pocket is 3.5 mm +/- 0.05 mm. This tolerance is easy to achieve, because in the manufacturing process of the ta
Electronics Forum | Mon Jun 17 17:02:38 EDT 2002 | kenbliss
Dave, in theory I agree with you, but in the real world isn't the expensive fruit, the fruit you spend countless hours trying to fix a small defect that has a fixed cost, the cost of the board as a single unit. Versus the cost of running the factory
Electronics Forum | Sat Aug 17 07:34:36 EDT 2002 | bentzen
Hi Ken First of all, I think you are right to point out that the uptime should be calculated on the SMD line bottleneck. But I have some comments to your posting in general: The SMD line bottleneck, you say, is always the palcement machine. This i