Electronics Forum | Fri Jan 15 11:33:46 EST 1999 | Bob Willis
| Hello, | | We are qualifying new sources of PWB vendors. We've got the first lot of "produciton" boards in and we want to put them through the paces before turing the vendors on. | | So far, the tests I can think of performing, and that we have
Electronics Forum | Fri Jan 15 09:36:20 EST 1999 | Earl Moon
| Folk's, | | I'm looking for information of how long you cna store a gold finish PCB before building it. I know there are problems with the gold disappearing into the underlying nickle over time / temperature etc but exactly how long do you have be
Electronics Forum | Tue Jan 05 18:07:53 EST 1999 | Dave F
| I am looking for information regarding post wave soldering of stranded wires into a circuit board using OA core wire solder. We do a final pass thru the cleaner after the hand soldering but I'm concerned about any OA flux residue that may have wic
Electronics Forum | Fri Nov 13 14:43:36 EST 1998 | Dave F
| | | | I keep hearing about polyimide stencils, but what are they like in terms of registration and aperture accuracy? | | | | | | | Fraser- | | | | | | We use polyimide stencils with great success for our prototype boards. They are cheaper a
Electronics Forum | Wed Nov 11 06:59:20 EST 1998 | Jim Mitchell
Scott - Good to see things are going well for you. With regard to your comments, Quad has introduced a complete line of Semi-conductor/APT machines (Q Series) that support both SMT and Semi-conductor applications. The machines were introduced in 19
Electronics Forum | Sat Sep 12 20:34:05 EDT 1998 | Rick Bell
| | | I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents becaus
Electronics Forum | Fri Sep 11 14:45:03 EDT 1998 | Earl Moon
| | I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because t
Electronics Forum | Fri Aug 21 14:29:37 EDT 1998 | Earl Moon
| HASL: (hot air solder leveling) is a process used to cover the Cu. Either Sn/Pb is used or Ni/Au or some other combo. In one case you create a land pad and in the other (with resin)you cover the Cu so that you only have a "trace." Is that correct s
Electronics Forum | Fri Aug 21 13:43:13 EDT 1998 | Ben Salisbury
| Hello everyone, | I am currently running a gold plated SMT board and am experiencing tiny solder balls between the pads and the masking between the 20 mil pitch devices. I'm looking at these boards with a 60x microscope. IPC-610 say's any visible s
Electronics Forum | Thu Aug 06 17:25:55 EDT 1998 | Earl Moon
| Is there any problem using SMT on gold boards? 15 years ago we were told not to use gold boards, but I can't remember why. Judging by the other postings it now appears to be common. Only problem I see is that the nickel should be plated, not ele
