Electronics Forum: plating (Page 225 of 260)

Re: Solder Balls

Electronics Forum | Fri Aug 21 13:43:13 EDT 1998 | Ben Salisbury

| Hello everyone, | I am currently running a gold plated SMT board and am experiencing tiny solder balls between the pads and the masking between the 20 mil pitch devices. I'm looking at these boards with a 60x microscope. IPC-610 say's any visible s

Re: Gold boards OK with SMT?

Electronics Forum | Thu Aug 06 17:25:55 EDT 1998 | Earl Moon

| Is there any problem using SMT on gold boards? 15 years ago we were told not to use gold boards, but I can't remember why. Judging by the other postings it now appears to be common. Only problem I see is that the nickel should be plated, not ele

Re: Pin in hole process problem

Electronics Forum | Tue Jul 28 16:13:45 EDT 1998 | Steve Gregory

| Hello everybody. | Remember I posted some questions on the smtnet regarding placing the thru hole connector using paste and reflow(pin in hole). I have able to accomplish the process succcesfully.....but I have a problem. The boards are failing at

Re: Stencil opening for 0603,0402 ?

Electronics Forum | Wed Jul 22 11:27:25 EDT 1998 | Russ Miculich

I agree with the response and strongly recommend that you use the "home plate" design to reduce solder ball entrapment, and that the under cut for the 0402's in particular be 80% of the pad size. Solder slump is typically about 1.2 to 1 so spread wi

Re: Gold boards

Electronics Forum | Thu Jul 02 14:46:34 EDT 1998 | Steve Schrader

| I'm having a problem getting good reflow on gold sufaced boards. The profile looks good and I have adjusted it both hotter and colder and adjusted the various times ( soak, reflow ) to no avail. What realy gets me Is that a month ago we built some

Re: TCE for Ais

Electronics Forum | Thu Jun 25 15:33:51 EDT 1998 | Earl Moon

| | Hi there, | | Does any one know what is TCE for fully wet saturated FR4. I came to know that for Dry FR4 the TCE is about 15-19 PPM �C. Is that true? | | | | Appreciated for your help. | | rgs, | | chiakl | Chiakl, | It looks like you are speaki

Re: Depanelization Troubles

Electronics Forum | Wed Jun 10 09:27:36 EDT 1998 | Steve Gregory

| We're running into problems with board damage (broken traces, solder shorts) due to pliers and other bizarre tools being used for depanelization. I need some sort of fixture for this. A delrin plate with a slot cut to the correct depth and width mi

Re: Help me increase my first pass yields

Electronics Forum | Fri Jun 05 13:06:14 EDT 1998 | Steve Schrader

| If you could measure and chart 3 variables in my process, what would they be? | The boards that I produce are on panels that are 12up and 2x4 up. All boards are single sided paper base w/o plated thru holes. They are on scored panels that measure

Re: Help me increase my first pass yields

Electronics Forum | Thu Jun 04 15:41:07 EDT 1998 | Chrys

| If you could measure and chart 3 variables in my process, what would they be? | The boards that I produce are on panels that are 12up and 2x4 up. All boards are single sided paper base w/o plated thru holes. They are on scored panels that measure

Re: Micro balls on gold fingers

Electronics Forum | Tue May 19 12:54:55 EDT 1998 | Richard Jackson

| We had a similar problem. But whenever the solder came from the screen printer the solder would wet to the gold fingers, with the help of residual flux. But the problem is balls, that I assume are not wetted to the gold fingers but instead are jus


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