Electronics Forum: plating (Page 227 of 260)

Re: Paladium Pillows and Bad Dreams

Electronics Forum | Wed Feb 25 01:24:34 EST 1998 | Steve Gregory

Dave, I confess I was a tad too general and a bit too extreme describing the way ALL solder joints look on palladium coated leads. I should been more specific about the "pillow-effect". I've seen it regularly with palladium coated leads on small SOT

Re: Wavesolder process characterization

Electronics Forum | Thu Feb 19 12:45:05 EST 1998 | Earl Moon

| I have an Electrovert Ultrapak 445 Wavesolder machine with 3 IR preheat zones and a single wave with omega wave. | I want to run a DOE (Taguchi) to determine the optimum settings for soldering both single-sided and | double-sided boards. Can any

BGA Via Plugging

Electronics Forum | Thu Feb 07 20:53:51 EST 2002 | davef

Regardless of the technique used for the mounting pad shape or definition, isolation of the plated through hole [PTH] from the mounting pad is important. If the PTH is contained within the mounting pad, solder will wick down the PTH. The amount of

BGA Straight crack

Electronics Forum | Fri Feb 22 08:26:51 EST 2002 | davef

You are correct. The gold dissolves in the solder. The gold is meant to protect the nickel from oxidizing, so that you can solder to the nickel. Obviously that didn�t work as planned. Your background information is very sparse. Two things come

0402 tombstoning

Electronics Forum | Thu Apr 11 20:35:22 EDT 2002 | davef

Messy. Messy. Messy. Consider gluing these components, until you control your process. It is unclear to us that a single factor drives these defects, but multiple factors that need to be tuned to work well together. PAD DIMENSIONS * Some SM-782 pa

press fit on Ni/Au board finish

Electronics Forum | Thu Apr 18 16:52:15 EDT 2002 | davef

General comments are: * First place I would look is the supplier of the pins that you are trying to install. Most suppliers that sell press fit components have done a good deal of work to qualify the component and will have all the specifications yo

Immersion Ag

Electronics Forum | Tue May 07 05:55:58 EDT 2002 | ianchan

Hi mate, do you mean : 1) Au = "ENIG" or "immersion Au(gold)"? or 2) Ag as in = "silver"? If Au is the correct term, no need to make extreme changes in your profile. just keep the profile to within your paste specs of preheat, reflow time and reflo

CMMs (Coordinate Measuring Machines)

Electronics Forum | Mon May 13 12:23:56 EDT 2002 | andyy

I agree with gregp on this one. I'm not going to discuss AOI as my company manufactures AOI systems, but I will comment on the CMM question as I use/have used these to qualify calibration targets and to characterize our systems. We actually have a

Moisture absorbtion in circuit boards

Electronics Forum | Thu May 09 17:28:33 EDT 2002 | davef

There is no IPC specification, nor should there be. * There are just too many peculiarities in the design and fabrication of PWB. * The issue is not defining how to store boards. The issue setting expectation for reliable products and allowing you th

Through holes

Electronics Forum | Thu May 09 17:24:11 EDT 2002 | davef

First, SM-782 elates to surface mount pads. So, expecting to find PTH design rules there is a bit of a stretch. Search the fine SMTnet Archives for similar threads. For instance here�s one from last week: http://www.smtnet.com//forums/index.cfm?fu


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