ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/1011-pbga-delaminations
. The package at lower left has a very large area of delamination (white area on substrate). In the package at lower right, there are smaller but significant areas of delamination/cracks around three sides of the die
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/1086-die-and-lead-delaminations
and Lead Delamination - Application Note 1086 Acoustic image of a SOIC showing delaminations (red), Diagram of a SOIC. Sample & Method This SOIC, taken from a failed consumer product, was imaged from the top on C-SAM with gating on the die face, lead frame and paddle around the die
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0299-pbga-die-face-delaminations
. The smaller red areas just outside the periphery of the die show delamination between the interconnect wires and mold compound. Delamination in this region can allow for moisture to collect leading to corrosion of the wires. In the non-defect (gray
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/2082-voids-and-delaminations
. The capacitor at bottom has a very large delamination between plates. It is not unusual for a single capacitor to have multiple delaminations at various depths
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/applications/test-and-inspection?con=t&page=10
: Test and Inspection DELAMINATIONS IN SUBSTRATE Nordson SONOSCAN PBGA MC to Substrate Delamination - Application Note 2600 TSOP DIE CRACKS Nordson SONOSCAN TSOP Die Cracks - Application Note 309
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/products/acoustic-inspection-systems?con=t&page=8
- Application Note 759 PDIP DELAMINATIONS ON THE BACKSIDE Nordson SONOSCAN PDIP Delaminations on the backside - Application Note 1053 CSP DELAMINATIONS Nordson SONOSCAN CSP Delamination - Application Note 540
Heller Industries Inc. | https://hellerindustries.com/request-software-manual/
& Articles White Papers & Technical Articles Videos Thermal Process Solutions Reflow Soldering Solutions Causes & Defects – Reflow Soldering Solder Ball Defects Opensor Insufficient Solder Wicking Defects Tombstoning PCB Soldering PCB Bridging Defects PCB Dewetting PCB Nonwetting Circuit Board Voids PCB Delamination
Heller Industries Inc. | https://hellerindustries.com/requestwarrantyreplacement/
& Articles White Papers & Technical Articles Videos Thermal Process Solutions Reflow Soldering Solutions Causes & Defects – Reflow Soldering Solder Ball Defects Insufficient Solder Wicking Defects Tombstoning PCB Soldering PCB Bridging Defects PCB Dewetting PCB Nonwetting Circuit Board Voids PCB Delamination Component
Heller Industries Inc. | https://hellerindustries.com/video/1936-mkv-vacuum-reflow-oven/
& Articles White Papers & Technical Articles Videos Thermal Process Solutions Reflow Soldering Solutions Causes & Defects – Reflow Soldering Solder Ball Defects Insufficient Solder Wicking Defects Tombstoning PCB Soldering PCB Bridging Defects PCB Dewetting PCB Nonwetting Circuit Board Voids PCB Delamination Component
Heller Industries Inc. | https://hellerindustries.com/video/reflow-soldering-oven/
& Articles White Papers & Technical Articles Videos Thermal Process Solutions Reflow Soldering Solutions Causes & Defects – Reflow Soldering Solder Ball Defects Insufficient Solder Wicking Defects Tombstoning PCB Soldering PCB Bridging Defects PCB Dewetting PCB Nonwetting Circuit Board Voids PCB Delamination Component
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