Electronics Forum | Mon Mar 29 14:29:50 EST 2004 | davef
Few people underfill PBGA. People underfill CCGA, uBGA, and FC. Consider a reworkable underfill on those devices that you expect to rework. Reworkable underfill candidates * Thermoset: ME526 (Red) * Loctite: 3567 (Cream) * Dexter: FP 4511 (Black)
Electronics Forum | Fri Apr 25 12:36:52 EDT 2008 | fsw
All, Does anyone on the forum have experience with underfill? We have a component with QFN pkg on one of the new products. It has a thermal pad in the centre. Customer wants this component to have an underfill. Questions - 1) Does one normally req
Electronics Forum | Thu Sep 04 03:27:52 EDT 2008 | akareti
All, Does anyone have experience with underfill 300balls BGA connector? We have a component with 300balls BGA connector that connectorize with Flex. Customer wants to have an underfill Questions - Possibility for underfill 300balls BGA connector -
Electronics Forum | Fri Mar 19 10:27:42 EDT 2010 | karlo
No clean pastes leave more flux residues. These can result in void formation and inhibtion of underfill curing. Selection of an underfill that is compatible with the flux residue is important. One company that has written about the effect of flux
Electronics Forum | Fri Sep 25 09:51:53 EDT 2020 | majdi4
I didn't understand your request.. Are you talking about underfill process (dispensing) or underfill with tape and reel packaging?? does the component drops at the 2nd reflow? that's why you want to go ahead for underfill process?? Thank you .
Electronics Forum | Fri Sep 05 12:15:34 EDT 2008 | evtimov
All, Does anyone have experience with underfill > 300balls BGA connector? We have a component with > 300balls BGA connector that connectorize with > Flex. Customer wants to have an > underfill > > Questions - Possibility for > underfill 300ba
Electronics Forum | Wed Mar 04 22:57:05 EST 2009 | davef
Underfill epoxies may be classified into major groups [Capillary Underfill Manufacturing Development and Characterization for 2nd Level Electronic Interconnect Processes; B Salom�n; University of Puerto Rico, Mayaguez Campus; Dec 2004]: * Capillary.
Electronics Forum | Mon Sep 28 13:03:43 EDT 2015 | dyoungquist
The melting point of the solder itself does not change when you have underfill. If the underfill conducts heat better than air, it will take less heat (and/or less time) from your rework station to get the solder up to the melting point. That makes
Electronics Forum | Thu Sep 21 08:29:57 EDT 2000 | Dave F
Is this underfill reworability an issue with the underfill material or you rework machine?
Electronics Forum | Fri Aug 20 09:02:09 EDT 1999 | Frank
Hello, does anyone knowwhere I can get an underfill stoage cabinet with first-in-first-out system
