Electronics Forum | Mon Aug 20 10:03:48 EDT 2007 | slthomas
Wow. Never have, never would, but that doesn't mean it couldn't be done. Mostly it just seems impossible to design a carrier clip that could hold both well...more likely it would hold one well and the other poorly, or both poorly. Anyway, is there
Electronics Forum | Fri Jun 18 11:31:17 EDT 2004 | gregp
I think it depends on the thickness of the PORON sheet. For .3mm balls you could probably get away with a pretty thin sheet (maybe 1/16"). I don't know how thin it comes offhand. For the part you are describing I woulf try maybe a 3.5mm OD and a 1
Electronics Forum | Thu Apr 12 22:54:06 EDT 2007 | mika
conductor on the narrowest place ~0.07mm we suggest them to go for a PCB solder pad down to 0.30mm. The Conductor width is: 0.2mm The current problem they are having now is that there will be a problem with 14V to narrow the conductor to the narrowe
Electronics Forum | Wed Jul 25 10:57:08 EDT 2007 | cecil
Our board layout folks are currently designing a PWB using a 132 QFN. The component is .5mm pitch with .35mm square pads. The component manufacturer recommends the following footprint: .4mm square land .3mm square solder resist 1.why do they spec
Electronics Forum | Fri Apr 06 12:25:55 EDT 2007 | mika
Thanks DaveF, Ohh I still whish there was a way to share some pictures... * Pads on pcb are very very strange: It varies from a non uniform pattern but after we measure these I would say ~0.22 - 0.24mm dia. Haha, We have never discovered such a stra
Electronics Forum | Mon Sep 28 08:08:30 EDT 1998 | Jimmy strain
| Does anyone out there have any pictures (jpeg preferred) of solder paste prints - or know where some are available. It will be awhile before our 35mm camera for our 3D scope arrives and I need some for inspection criteria. I need the good, bad, and
Electronics Forum | Sun Apr 01 09:26:13 EDT 2007 | mika
Thanks DaveF, I think the IPC-7525 - Stencil Design Guidelines (which is overall a pretty good guideline) does not perfectly apply in this case. I would rather go for a little bit over print, as for a CCGA; unless I misinterpreted the info. I really
Electronics Forum | Fri Apr 06 18:17:49 EDT 2007 | davef
Mika: Based on what we hear you saying, we're not so sure we have a problem with the board layout [1:1 between board and interposer pads, non-solder mask defines pads], but with the flawed execution of the layout. If your board fabricator decides to
Electronics Forum | Sun Apr 15 19:55:52 EDT 2007 | darby
Mika, I think you will find all board houses "clean up" their customer's files to suit their shop. Depending on the severity of the change; I think they take the attitude that they will not inform you to avoid an argument going backwards and forwards
Electronics Forum | Fri Nov 02 04:34:35 EDT 2007 | aj
Hi all, Thanks for the replies so far. To make things clearer. BGA is 35mm square. Leading edge of BGA hits 217 and then trailing edge hits 217 5 seconds later. So leading edge is reflowing when the trailing end is not. Coming out of the reflow
