Electronics Forum | Thu May 06 17:23:02 EDT 2004 | davef
Ah, here it is: EFTEC-64T. A commercial leadframe material with the nominal composition of Cu-0.3Cr-0.25Sn-0.2Zn
Electronics Forum | Wed May 02 02:41:30 EDT 2007 | May
Of course it is needless to say the performance of SACX0307 is worse than SAC305, and also to some other lead free solders,eg SN100C & SCS7.
Electronics Forum | Mon Mar 15 01:38:46 EDT 2021 | researchmfg
Thanks for the answer. Did you really find the dust block the nozzle and sensor? By the way, If SMT environment need to control the dust then what size of dust need to be controlled? 0.3um, 0.5um or 10um?
Electronics Forum | Wed Apr 07 03:44:40 EDT 2010 | jackevest
The missing rate spec. of normal machine is under 0.3%, for our experience 0.1% is normal for average, if you can maintain the machine well, like the nozzle cleaning, feeder maitain...you can keep the 0.05%.
Electronics Forum | Wed Feb 07 23:33:13 EST 2007 | KEN
It's been a while on that platform, but isn't there supposed to be a 0.3mm nozzle compliance when at Z0?
Electronics Forum | Mon Jun 19 10:30:30 EDT 2023 | smtusa
Jet printing can reach 80um, whereas contact dispensing is 0.3mm I believe. 0402 pads are 0.6x0.5mm.
Electronics Forum | Wed Sep 18 15:13:17 EDT 2002 | davef
Effects of Gold (Au) on Solder Properties Concentration Range in Weight Percentage w/o Au in Sn63/Pb37 Solder [A Sugarman/Loranger] * 2.0 - 3.0% Spreadability and fluidity of solder reduced (1) * 3.0% Highest acceptable concentration of Au in solder
Electronics Forum | Fri Jun 09 17:09:23 EDT 2000 | JAX
Khalid, Just from experiance the actual would be 0.4mm but the inspection size would be 0.3mm. This should not matter since you should be able to pull up the spec sheets on any part you place.( All you need is the Vendor and the manufacting part numb
Electronics Forum | Wed Jun 09 02:35:10 EDT 2004 | Bernard
Base on the PORON foam rubber recommended, is it possible to apply on small BGA chip of 4x4 ball size 0.3mm. Any specific part no and supplier for this type of foam and is it a anti-static material? Would it be possible to punch out at dia. 3mm?
Electronics Forum | Tue Mar 08 08:28:12 EST 2005 | py (france)
a french subcontractor had tried this alloy for a show (in france). I was here , the PCB was not to hard to weld , but the results were not as good than Sn63pb37.(of course) the advantage is the price. see cookson for details.....
