Electronics Forum | Thu May 31 15:32:56 EDT 2001 | dspilker
I saw a post from last year that quoted Hadco. For a .062" thick PWB, the remaining material was .012" +/- .002". This is close to what we have been using, but some PwB vendors are now asking for .020" +/-.005". This seems too thick for smooth bre
Electronics Forum | Wed Sep 25 11:11:14 EDT 2002 | xrayhipp
Try .005 or even .004 thick laser cut electopolish stencil and reduce grain size of paste. Go with 400 or 25 in the case of AIM. We had a similar prob.
Electronics Forum | Tue Apr 01 13:17:49 EST 2003 | cyber_wolf
The problem is that there are also SOT23's present. I would use a .004 or a .005 stencil, but I don't think that the dots are going to contact the bottom of the larger packages on a thinner stencil. ...Thanks for the input.
Electronics Forum | Tue Apr 01 18:21:48 EST 2003 | slthomas
I've never printed adhesive but I assume that aspect ratio still plays a part with release. Maybe that .006" is just to thick to get good release. Can you step your stencil down from .006" to .004" or .005" for the 0402's?
Electronics Forum | Tue Jul 08 07:01:40 EDT 2003 | davef
Try: * ANSI/J-STD-004 - Requirements for Soldering Fluxes * ANSI/J-STD-005 - Requirements for Soldering Pastes * ANSI/J-STD-006 - Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering App
Electronics Forum | Tue Mar 01 03:25:33 EST 2005 | bing
We are using a GDM with a linear piston pump fitted to dispence adhesive on 0603's. Use Universal part number 43273801 needle with a 42346504 piston. The single needle dimentions are 0.010 ID, 0.028 OD, 0.005 stand off
Electronics Forum | Thu Dec 08 09:47:46 EST 2005 | slthomas
I'm with Grant on the .005" foil thickness. The key is to keep your aspect ratio (aperture width/foil thickness) over 1.5, laser cut, and I like trapezoidal aps. too.
Electronics Forum | Sat Nov 18 08:42:11 EST 2006 | davef
Bow & twist: IPC-A-600. Acceptability of Printed Boards 1.5%; Goal 0.005" per inch; Practicle 0.007" per inch
Electronics Forum | Mon Dec 17 12:15:10 EST 2007 | Claude_Couture
What a coincidence! Our last solder analysis showed our Ge to be .001% and the lab recommended to bring it up to .005% to get a better wetting. They even supplied a formula to calculate the amount to add based on the % and the quantity of solder in t
Electronics Forum | Fri Jul 11 02:42:40 EDT 2008 | aj
Thanks Dave, IPC-6012 states min at 0.05um. Has this been a update or is it for a different class? thanks, aj...
