Electronics Forum: 031 (Page 3 of 6)

Halogen-free Solder Re-flow Quality Issues

Electronics Forum | Tue Aug 25 07:48:41 EDT 2015 | derrikf

Both pictures are from .031" FR4. According to my MOLE it's actually staying above the liquidus temperature for close to too long. Datasheet says 90 secs, I'm in the high 80's. Not ruling it out as a possible cause, I suppose the data I'm getting c

Conformal Coating Killing Circuits

Electronics Forum | Wed Jul 29 21:16:17 EDT 2020 | SMTA-64387706

Hi, I have a PCB that works fine when tested before conformal coating with HumiSeal 1B73. It seems like the CC is causing electrical issues. We brush it on, so it is a bit thick. After curing we are getting QFNs that do not seem to connect well and a

0.031 pcb bowing -- solutions?

Electronics Forum | Mon Aug 27 11:11:16 EDT 2012 | rway

We have 1/2 dozens 0.031 pcbs that bow after going through the oven. We are looking for a solution to this problem to prevent bowing of the pcbs. As a result of the bowing, the pcbs, on occasion get caught in the oven, and more often have transfer

Re: Resistor Paks on solder side of board

Electronics Forum | Thu Jul 20 15:37:53 EDT 2000 | Tekguy2000

These parts are flat chip resistor arrays that have 4 end terminations on each side. It looks liek an IC but is typically in an 0805 and 1206 package type with convex terminations. .031" pitch from termination to termination and .011" spacing between

Micro-BGA soldering

Electronics Forum | Mon Jul 26 12:55:34 EDT 1999 | M.L

Presently protos of micro-bgas (80i/o) pitch .030/.031 12BGA per assembly The board is a (.062, 4 layers) FR-4 using Dry film Pads .014inch Vias within footprint .020inch Vias to be filled by bottom side(solder side) only .030in dia. Force via plugg

Re: Depanelization Troubles

Electronics Forum | Wed Jun 10 17:04:10 EDT 1998 | David Spilker

| We're running into problems with board damage (broken traces, solder shorts) due to pliers and other bizarre tools being used for depanelization. I need some sort of fixture for this. A delrin plate with a slot cut to the correct depth and width mi

Water soluble flux

Electronics Forum | Tue Oct 22 14:57:18 EDT 2002 | Jim M.

I use a water soluble flux to solder an LCD into gold plated through holes of a .031 circuit card. Problem is the current water soluble flux (850-33) is not made anymore (the drop in replacement has a different formuala and does not work). The main i

Very Low Volume BGA Assembly

Electronics Forum | Tue May 23 09:58:35 EDT 2006 | flipit

I would take a BGA over a fine pitch QFP any day of the week. Unless it is a BGA with a high ball count, place them by the body if you don't have upward looking vision. Make sure your reflow process is good and the parts are placed in the correct o

Need Philips CSM84 PA1306/20 service manual

Electronics Forum | Wed Nov 25 12:27:18 EST 2009 | andras

Here are the manuals: http://www.toldacuccot.hu/dl.php?sid=ea6f1feeba21ce26cb798edddc031c0f&file=CSM.part1.rar http://www.toldacuccot.hu/dl.php?sid=b6528b8ac0bdbbd3ee96f4f1e728e77f&file=CSM.part2.rar http://www.toldacuccot.hu/dl.php?sid=79db96a97060

Trace Distance to Board Edge

Electronics Forum | Wed Aug 08 17:50:22 EDT 2007 | flipit

X7R >Z5U,Y5V Greater means less likely to crack or in other words NP0 is better than X7R for crack resistance. Don't think that there is a set formula. There isn't! I cracked ceramic resonators at 0.050" from the board edge with CAB M2 and M3 dep


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