Electronics Forum | Tue Jul 30 03:57:29 EDT 2019 | SMTA-David
Hi, I am looking for software for 2003 model 1707 EXL reflow oven (HC1 controller). I believe latest version for that model is 1.0.6.5.8 (98 Win) or 4.0.2.1 for XP. Thanks
Electronics Forum | Tue Feb 12 14:00:53 EST 2013 | dyoungquist
We have a board with a 1.0mm pitch BGA. The stencil apertures are 0.0177 inch diameter. We used an electroform stencil with good results.
Electronics Forum | Tue Nov 23 19:00:30 EST 1999 | armin
I've got a 100mm X 70 mm Dense PCB...The via holes used is 1.0 mm some are under SOIC's ...what problems that this type of via design poses ? all ideas are welcome ! thanks and regards, armin
Electronics Forum | Fri Feb 01 19:07:57 EST 2002 | fujiguy
Yes Smema is used in the industry. It allows the equipment of different manufacturers to comunicate with out extensive rewiring. Both SMEMA 1.0 and 1.2 are used. An experienced SMT manufacturer wil include both for options.
Electronics Forum | Wed Aug 21 01:40:42 EDT 2002 | jkhiew
Hi all, Our management set target 50 ppm for overall process like printing,mounting & reflow soldering. Our m/c cpk for mounter is 1.0 & for printing is 1.33. So, pls comment !
Electronics Forum | Tue May 25 10:40:06 EDT 2004 | smokejumper
This could be a dirty glass scale. alignment or gap. step one clean the glass scale. if the number changes 1 - 0 when you move the head it is probably an aligment or gap issue.
Electronics Forum | Fri Feb 25 23:26:27 EST 2005 | siverts
Good point [engguy], and another thing; if you are using 1.3mm nozzle on a feeder that has a shutter opening of 1.0mm = problem. You could even damage the nozzle. So the main questions remain....
Electronics Forum | Tue Aug 23 09:02:12 EDT 2005 | Bob R.
There are several methods in IPC-TM-650 depending on whether you're testing for the effect of flux residues or board cleanliness. They're available for free download here: http://www.ipc.org/contentpage.asp?PageID=4.1.0.1.1.6
Electronics Forum | Tue Sep 19 21:24:59 EDT 2006 | davef
JEDEC - http://en.wikipedia.org/wiki/JEDEC IPC - http://www.ipc.org/contentpage.asp?Pageid=2.1.0.1 You should use the design rule that produces the best results.
Electronics Forum | Fri Feb 16 08:28:50 EST 2007 | pavel_murtishev
Good afternoon, Typical plating thickness for immersion tin is 0.6-1.0um. I do not know what the maximal thickness is. But plating is self-limiting process and I believe maximal thickness should be about 2-3um. BR, Pavel