Electronics Forum | Sun Jun 13 09:54:30 EDT 2004 | Andy Wong
I am working on an acrylic coating with solid content around 30%, I want to control the coated thickness to be 1 mil exactly. Any experience on this. Best regards.
Electronics Forum | Fri Sep 23 04:06:43 EDT 2005 | Rob
Make sure you have the 1 mil & 4 mil cameras so you can cover virtually any component.
Electronics Forum | Mon Jan 14 10:51:23 EST 2008 | geb
Interesting... where are you based? I am in the UK. What types of components benefit from having a 2.6mil over a 1mil?
Electronics Forum | Tue Jun 28 14:06:08 EDT 2011 | dmiller
If you have room, and the aperture size will allow for it, try a 5 mil overall stencil thickness with a 1 mil step-up in the area of the BGA connector.
Electronics Forum | Fri Mar 15 18:11:46 EDT 2013 | isd_jwendell
I've seen 1-mil Kapton tape. Would that work, or would it be too thick? I've never tried it... How thick is the average solder mask?
Electronics Forum | Fri Mar 15 18:26:51 EDT 2013 | hegemon
We avoid kapton in this situation due to the thickness. 1 mil additional thickness can equal up to a 20% increase in paste volume at adjacent pads if you are using a 5 mil stencil. But then again, that is not always bad. But must be taken into consid
Electronics Forum | Wed Jul 13 19:47:06 EDT 2005 | Darby
This works for me with ENIG finish and a SAC305 NC paste Reduce all pads by -2mil on all sides ie 0.050" x 0.050" becomes 0.046" x 0.046" EXCEPT Anything smaller than 30mil; -1.5mil Anything smaller than 20mil; -1mil Anything smaller than 15mil;
Electronics Forum | Tue May 25 12:59:37 EDT 2004 | gregp
Mils to MM is actaully English to metric. 1 mil is equal to 1 thousandth of an inch (0.001")or 0.0254mm so... 12mil pitch qfp is 0.012" or 0.3mm 15mil pitch qfp is 0.015" or 0.4mm 20mil pitch qfp is 0.020" or 0.5mm (Numbers are rounded)
Electronics Forum | Thu Apr 29 09:02:02 EDT 1999 | Frank Boyko
| Can anyone in this world produce such small PCB/PWB trace widths? Lots of theory so far, but have not found anyone yet who can do it in practice. If anyone can it will be IBM. Call Voya Markovitch at 607-757-1335 (Endicott, NY). He is a technical
Electronics Forum | Sat May 24 00:43:59 EDT 2003 | iman
Our engineers did a study on our medical product with 1mils standoff height, and one issue was 100% of the boards that underwent ultrasonic failed due to failure of the package wirebonding. Poor reflow control would be one area to review in any event
