Electronics Forum | Fri May 29 16:07:55 EDT 1998 | Steve Gregory
| | Thanks Steve- | Here is the whole story: | | The solder balls are appearing all over, similar to a | splatter. They are relatively small. We are using H-Technologies | S-HQ no-clean solder paste. The stencil is 6 mil and the boards | are ru
Electronics Forum | Sun Aug 29 18:08:29 EDT 1999 | M Cox
| | | fuji gp, cp642e, ip3 and other | | | | Dear Sir, please explain what you mean by GP, are you referring to Fujiu GSP printers? if so, what models are you looking for. We have GSP3-5000 and GSP3-4000 avaiable for immedate sale at $25,000 each. F
Electronics Forum | Mon Feb 25 21:09:48 EST 2002 | davef
You are correct about a TCE [CTE] mismatch issues in ceramic packages. The coefficient of thermal expansion [ppm/�C] of major ceramic package elements are: * Silicon - 3 * Standard 92% alumina ceramic � 6.5 * FR4 board � 18-20 Several points are: *
Electronics Forum | Fri Jun 12 07:50:18 EDT 2009 | davef
Advanced Coating; 10723 Edison Ct, Rancho Cucamonga, CA 91730; 800-722-1444 F909-481-1427 info@advancedcoating.com advancedcoating.com C-C Technologies Inc; 761 Blossom Hill Ln, Dallastown, PA 17313; 717-577-6559 F717-246-6882 Electronic Coating T
Electronics Forum | Tue Dec 24 11:01:19 EST 2013 | davef
I wouldn't get too tightly wrapped around the axial of paste suppliers recommendations of thermal recipes. Said another way, "Do not count on the solder paste representatives for good technical advice--they are the ones who came up with these "'TIME
Electronics Forum | Thu Dec 07 17:25:58 EST 2017 | davef
Help me understand your issue better ... Are you looking to: * Improve your products that are used for thermal cycling testing of products of other companies? * Change your production materials so that you pass thermal cycling testing of your produ
Electronics Forum | Fri May 29 17:19:54 EDT 1998 | Earl Moon
| | | | Thanks Steve- | | Here is the whole story: | | | | The solder balls are appearing all over, similar to a | | splatter. They are relatively small. We are using H-Technologies | | S-HQ no-clean solder paste. The stencil is 6 mil and the
Electronics Forum | Mon Jun 01 14:35:59 EDT 1998 | Rich
| | | | | | Thanks Steve- | | | Here is the whole story: | | | | | | The solder balls are appearing all over, similar to a | | | splatter. They are relatively small. We are using H-Technologies | | | S-HQ no-clean solder paste. The stencil is
Electronics Forum | Wed Jun 10 18:40:00 EDT 1998 | Earl Moon
| I am looking for the Industry standards on vias. Are they required to be plated with solder or is copper plating enough? What about reliabilty with either one? Also, if tenting the via is required should it be copper plated or solder plated over
Electronics Forum | Fri Jun 05 19:33:55 EDT 1998 | Steve Gregory
Hidee Ho Brian! Just like the other Steve, we just bought a SPM too. Our is brand new, and it's a SPM-AV (has vision). The other option we have is a automatic underside stencil cleaner. We're a contract assembler as well, just starting up.
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