Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Industry News | 2023-08-01 19:17:59.0
GRAND JUNCTION, CO USA - August 2023 - GPD Global, a manufacturer of precision fluid dispensing systems for high-volume 24/7, low-volume/high-mix, and R&D production is delighted to announce the launch of new website that features a modern design, improved navigation, updated content, and enhanced functionality.
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
Technical Library | 2023-09-07 14:38:31.0
A repeat customer specializing in high-technology interconnect, sensor, and antenna solutions, partnered with us to dispense small volumes of solder paste (Indium 10.1 SAC305 T6SG 78%m) onto backplane connectors – gold pads 0.175mm x 0.225mm. We performed a test requiring 0.200mm diameter or smaller dots to demonstrate the dispensing capability required.
Technical Library | 2023-09-07 14:54:10.0
A global manufacturer of a broad line of electronic interconnect solutions worked with us to dispense conductive adhesive EpoTek H20E-FC. EpoTek H20E-FC is a two-component, electrically conductive, snap curing epoxy for photovoltaic thin film module stringing, semiconductor packaging and PCB circuit assembly. The primary goal was filling a rectangular cavity on a connector. The epoxy needed to fill the connector to the top of the walls in less than three seconds.
Industry News | 2023-08-23 15:08:19.0
Next generation hardware designs are incorporating the world's fastest silicon with massive gigaflop compute power to drive data throughput.
New Equipment | Assembly Services
Electronic Assembly Services Turnkey production assembly services from small to large sized production, production builds of various sizes, ranging from a few boards to thousands. We are also a good fit for customers whose orders are large enough t
Industry News | 2023-09-11 16:48:35.0
MIRTEC is excited to announce its participation in the highly anticipated SMTA International Exhibition, scheduled to take place at the Minneapolis Convention Center in Minnesota from October 10-11, 2023. MIRTEC will proudly showcase its groundbreaking MV-6 OMNI 3D AOI Series featuring the exclusive OMNI-VISION® 3D Inspection Technology in booth #1201.
Industry News | 2023-11-20 15:14:33.0
MIRTEC announces its receipt of the prestigious 2023 GLOBAL Technology Award in the Conformal Coating Equipment category. The award was presented in recognition of MIRTEC's groundbreaking GENESYS-CC AI Based Conformal Coating AOI Series during an award ceremony held at productronica in Munich on Nov. 14, 2023.
Industry News | 2023-10-30 18:40:38.0
MIRTEC today announced that it is the recipient of the 2023 Mexico Technology Award in the Conformal Coating Inspection category for its revolutionary GENESYS-CC AI Based Conformal Coating AOI Series. The award was announced during a ceremony held on Wednesday, October 25, 2023 during the SMTA Guadalajara event in Mexico.
