Industry News: 2mm (Page 3 of 12)

Christopher Associates Premiers Solder Pastes from Koki for ICT Performance and Fine-Pitch Printing

Industry News | 2009-12-14 20:45:09.0

December 2009 ? Christopher Associates, a pioneering supplier and distributor to the electronics and chemical processing industries, introduces two new solder pastes from Koki Company Ltd. (Tokyo, Japan).

Christopher Associates Inc.

Test in Carriers: New Customer for the Multitest InCarrier®

Industry News | 2011-06-07 15:02:59.0

Multitest has received another order for its unique InCarrier® test equipment from a major test house in Asia. The InCarrier® was preferred against standard singulated package test as well as other methods of high parallel test.

Multitest Elektronische Systeme GmbH

Plated Half-Holes(Castellated Holes)

Industry News | 2019-11-05 22:17:26.0

Plated half holes(castellated holes)are holes that made off the edge of the boards plated with copper using a specialized process. It is predominantly used for board-on-board connections, mostly where two printed circuit boards with different technologies are combined. Through connecting the PCBs together directly, the whole system is considerably thinner than a comparable connection with multi-pin connectors.The plated edges are also useful in producing mini PCB modules.

Headpcb

Simplimatic Automation Introduces Precise, Cost-Effective Multiple Axis Laser Marker

Industry News | 2014-09-10 11:42:09.0

LAN Compatible Marker Delivers High-Speed Capabilities for Any Marking Needs

Simplimatic Automation

Henkel develops materials innovations for high power electronics

Industry News | 2012-04-27 19:07:14.0

Advances in power electronics are key to a sustainable energy future: Semiconductor power devices such as insulated gate bipolar transistors (IGBTs) deliver the high switching speeds which are critical for energy efficiency in electric cars, trains and other industrial applications. For the use of alternative energies, ultra-high efficiency and high-power density designs are imperative. Recognizing these market needs, Henkel has developed a comprehensive range of materials to further advance power electronics technology and will showcase these innovations from 8 to 10 May at SMT in Nuremberg.

Henkel Electronic Materials

Vishay Siliconix New 150-mA LDO Regulators in Small SC-70 Package

Industry News | 2005-08-03 13:41:41.0

Combining Low 130-mV Dropout with High 150-mA Current

Vishay Intertechnology, Inc.

Hesse Mechatronics Launches Heavy Wire and Ribbon Bonding Services for Early Stage Product Development

Industry News | 2013-05-06 18:13:00.0

Hesse Mechatronics will offer application development, prototyping and pre-production services on a newly installed BONDJET BJ939 Fully Automatic Heavy Wire Bonder at the company’s west coast demonstration and applications lab, located at long-time company manufacturer's representative Chalman Technologies in Anaheim, California.

Hesse Mechatronics

Pulse Electronics Introduces Monarch Series Multi-mode Satellite Navigation System Ceramic Antenna for GPS, GLONASS, Beidou, and Galileo

Industry News | 2016-01-20 19:07:38.0

Pulse Electronics Corporation's new Monarch Series multi-mode global navigation satellite system ceramic antennas provide wireless signal reception for the four major global and regional satellite systems: GPS, GLONASS, Beidou (Compass), and Galileo. The Monarch Series W3010 is a compact, low profile antenna that delivers high efficiency (75% typical) over a wide bandwidth for enhanced navigation and device tracking. With its profile of 3.2x10x2mm, low weight of 310mg, and VSWR of less than 1.6:1, the Monarch Series fits antenna requirements for items such as portable personal navigation devices, asset tracking equipment, mobile hot spots, mobile point-of-sale terminals, digital walkie-talkies, vehicle data recorders and video systems, public safety devices, telematics equipment, and Internet of Things devices.

Pulse Electronics

Nordson MARCH's Plasma Confinement Ring Increases Etch Rate and Improves Treatment Uniformity for Wafer Processing

Industry News | 2016-09-21 15:33:30.0

Nordson MARCH introduces its Plasma Confinement Ring for wafer processing and wafer fan-out applications. The ring concentrates and focuses the plasma directly over the wafer to speed up the etching process, provide uniform plasma coverage, and to isolate the plasma on the wafer itself rather than the area around or below it. Process temperatures can be kept low because the ring increases etch rate capability without the need to increase the electrode temperature or add bias to the chuck.

Nordson MARCH

FCI Receptacles Take to Standard SMT Processes

Industry News | 2003-04-15 08:23:22.0

Metral TINT back panel receptacles are compatible with standard pin-in-paste SMT processes, eliminating costly secondary assembly operations including heat staking, wave soldering or press fitting.

FCI


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