Electronics Forum | Mon Jul 12 12:39:39 EDT 1999 | M Cox
| I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-laye
Electronics Forum | Tue Mar 05 22:34:27 EST 2002 | YoYo
You better be careful how you plug vias at screenprint - we currently have a customer that wants vias plugged, so we had a 2% aperature reduction so we would not have to much paste, I believe it should have been reduced more because some of the solde
Electronics Forum | Thu Apr 27 11:50:21 EDT 2006 | samir
90% of the battle with thermal profiling is your thermocouple attachment. That is Process Engineering 101. It's just like painting your house. The masking and prep work will make or break the end result. KIC did a DoE on which thermocouple attach
Electronics Forum | Mon Aug 14 03:38:37 EDT 2017 | spoiltforchoice
The pads in the datasheet should suffice. The TDK part really isn't all that big but its reflow profile indicates it is not exactly the most tolerant device with regards to heat. 245C for 5s is not a lot, I would check very carefully that your profil
Electronics Forum | Thu Mar 15 12:33:50 EDT 2007 | ck_the_flip
To do a profile at most companies, if you don't have a scrap board handy, you'll use the already-soldered board that's already been through ONE reflow cycle. You spend time attaching T/C's with the aluminum tape - after all, the prep-work is half th
Electronics Forum | Wed Feb 12 02:38:02 EST 2020 | majdi4
Hi there , I agree with phil .. but we cannot change the architecture of the card to mount the connector on the 2nd side. Steve , we are producing large series, so we can't manually ship bond the connector .. for the moment, we cannot invest in a gl
Electronics Forum | Fri Mar 02 09:08:25 EST 2007 | samir
There is a formula that determines whether a component will fall off during a 2nd reflow. It takes into account the grams (weight) of the component and the total surface area of the solder joints. I don't know this off the top of my head, but it's
Electronics Forum | Thu Jun 12 00:32:23 EDT 2003 | Henry
I would like to ask a question about SMT reflow process. I did 10 pcs samples but all is fail. The sample is double faces to have components (up-side has 4 pcs of BGA and down-side has 3 BGA and 2 QFP). And I saw some of BGA which is tilting in the P
Electronics Forum | Thu Jun 23 08:58:00 EDT 2005 | Irene Taylor
We are defining a new assembly process for a double sided card that has 26 BGAs on the top side and 14 BGAs on the bottom side. We currently have one double sided BGA board with one BGA per side and have to epoxy one BGA (35mm X 35mm - 352 ball count
Electronics Forum | Tue Oct 31 13:22:51 EST 2006 | realchunks
Are you using Houdini brand paste? It really depends on the part and pad size, but I kinda doubt that you�re paste is disappearing during the 2nd reflow. Do a side by side comparison of first pass versus second pass reflow and show your operator.