Electronics Forum | Wed May 07 08:16:58 EDT 2014 | emeto
It really depends on pad design and other component on the PCB. Most of the time I run 0201s I have microBGAs on the board and usually print 3mil. Reduction will depend on the paste. For leaded paste you will have reduction (about 10% or so).For Lea
Electronics Forum | Tue Jan 31 09:41:06 EST 2017 | emeto
If there is no specific quality reason, stay with paste. More processes you add, more points of failure. They don't need a lot of paste to get attached to the board. The ones I used were 8mil round apertures, so I did cut 1:1 on a 3 mil coated stenci
Electronics Forum | Mon Dec 02 08:43:20 EST 2019 | scotceltic
What are people using out there for minimum spacing between vias ? We recently came across a PCB manufacturer that wants us to increase our spacing due to their process. Below is our current spec. that we follow. Spacing between via pad to via pad o
Electronics Forum | Thu Jan 28 22:27:00 EST 2021 | emeto
Nowadays is not a big deal to cut step stencils. Stencil houses charge you around 100USD per step in addition to your regular price. Some places are welding the step area with a very small clearance and I have to say mostly it is pretty accurate. In
Electronics Forum | Thu Sep 17 15:21:50 EDT 2020 | lpbro
For height, I start +-2mil usually. For 3mil stencils, my lower limit starts at 1.5mil, upper is 5. If the area is chem ethed, I normally add .5 to the stencil height. My default volume is 60 - 160%. Then print specs are adjusted till I see fit, then
Electronics Forum | Wed Sep 19 16:38:07 EDT 2007 | jseagle
Of course there are differences, different equipment, software, tools, etc... We just got a set of questions from a PCB house asking about soldermask clearance between 16 mil pitch pads. Our current manufacturer can put down 3 mils of soldermask.
Electronics Forum | Tue Sep 21 13:43:33 EDT 1999 | Glenn Robertson
| I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. | The stencil is 6 mil thick, laser cut and electo-polished. | The apertures are 12 mil in diameter with 20 mil pitch. | We are usi
Electronics Forum | Mon Oct 19 17:40:01 EDT 1998 | Eric
Nate, If your stencil vendor has laser-cutting capabilities, they should be able to burn in your fiducial locations. This process involves re-setting the focus of the laser beam to burn the locations 1-3 mils into the surface (as opposed to 1/2 cut
Electronics Forum | Mon Feb 03 12:52:42 EST 2003 | MA/NY DDave
Hi I won't give you an answer directly yet I hope the following makes sense. The max rework depends on what is used in the reliability model and/or experimental data as worst case for the applications end of life reliability needs. E.G. let's say
Electronics Forum | Wed Aug 24 22:53:34 EDT 2005 | mrduckmann2000
We have a customer that is using the new Hirose connector p/n df30fc-40dp-0.4v. The connector has lead spacing of .4mm. I beleive that if I have a stencil cut to 2-3 mil I should have enough solder paste to solder the connector to the PCB pads. Ho
