Electronics Forum: 4mm (Page 3 of 31)

Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch

Electronics Forum | Tue Nov 12 00:49:37 EST 2019 | myke03o

I am optimizing a stencil opening for BGA with 0.4mm pitch and pad diameter of 0.2mm. Can anyone advice of stencil thickness and stencil opening I can use in order to have a good paste release. Thanks for all your answers.

Baking components at 70 degree

Electronics Forum | Wed Dec 19 14:02:18 EST 2007 | gersla

We decided to bake components in tray package at 70 Degree prior soldering. I am looking for suggestion regarding baking time for MSL3 components: Up to 1.4mm package thickness 1.4-2 mm thickness 2-4.5 mm thickness In JEDEC-033B this temperature is n

compactflash memory process requirements

Electronics Forum | Fri Apr 19 07:50:24 EDT 2002 | pjc

I used to build flash memory products for M-Systems. Up to 30,000 per week. Nothing special in the process for these boards. 1mm and 0.4mm thick std. FR4 PCBs are used. Double-Sided reflow. The 0.4mm thin boards require process carriers. Panelized 24

Step-up stencil: recommendation thickness

Electronics Forum | Tue Aug 20 21:39:29 EDT 2019 | sssamw

6 mil (0.15mm) for the 1.13mm pitch BGA, and 4 mil (0.1mm) for the smal QFN with 0.4mm pitch.

New Pick and Place Operation

Electronics Forum | Wed Jun 02 18:28:17 EDT 2004 | russ

I would look at the Samsung CP40 or 45. They have the placement rates you want even a little better on the 40. the 45 will double that easily. They handle all types of parts down to 0201 components. Depending on the camera you select (25mm) you ca

screen printer - vision

Electronics Forum | Thu Apr 29 10:49:05 EDT 2004 | pjc

Yes, using an illuminated magnifing glass helps. How well your board fixuring is on the table will effect print alignment on other boards loaded. 0.5mm & 0.4mm will require very good fixuring, like you can get with tooling pins if the board has non-p

0.4 mm Pitch BGA stencil design

Electronics Forum | Mon Nov 01 10:29:13 EDT 2010 | scottp

I've searched the archives and maybe my search skills aren't up to snuff but I couldn't find much. I'm curious what people are doing for 0.4 mm pitch BGAs, assuming a type 4 paste. Pad diameter? SMD or NSMD? Stencil thickness? Aperture diameter? Us

0201 placement on Fuji CP4-3

Electronics Forum | Thu Mar 01 16:39:29 EST 2012 | triadelectronics

Our company is going to attempt to place 0201 components using our Fuji CP4-3 with the upgraded SMD3 vision system. Count On Tools is providing the 0.4 mm nozzles and we are using our 8mmX2mm feeders with the 0.7mm tape leaf (if it works at all we w

Board stop on DEK printer

Electronics Forum | Thu Mar 29 12:23:55 EDT 2007 | dekhead

Size is 21mm (relaxed) x 4mm (OD) x 0.25mm wire... Manufacturer is Flexo Springs But for an in stock item that costs not much more than $1... I would think hardly worth the time and effort to have one made.

SMD machine

Electronics Forum | Mon May 18 13:09:55 EDT 1998 | Edward P. Woldendorp, TwenTech

Wanted: by customer in the Netherlands: + used Zevatech PM575 SMD machine or comparable make and type having .4mm pitch and Vision. Capicity: 4,000 comp/hour will do. If available please give full configuration, age, location, asking price. Thank you


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