Used SMT Equipment | In-Circuit Testers
Teradyne Spectrum 8852 In Circuit Tester For Sale The tester is configured as follows: Front Cage FIB-0 / MX1 VP Prism (8) CC2-DIG-128ch FIB-1 / TEK Rear Cage (1) CC2-DIG-128ch VP-EXT MXI Note: Tektronix VX4101A (VXI MultiPaq Inst
Used SMT Equipment | Soldering - Reflow
Very Nice Thermotron Oven For Sale The oven is very clean with low use and in very good condition Both heating and cooling is working nice! See attached pictures and information below. •Thermotron Oven •Model Number: S-32C •Serial Number: 512/25
Used SMT Equipment | General Purpose Equipment
Very Nice Thermotron Oven For Sale The oven is very clean with low use and in very good condition See attached pictures and information below. •Thermotron Oven •Model Number: S-32C •Serial Number: 512/25-3400-01RF •Inside Dimensions: 38 x 38 x 38
Used SMT Equipment | Pick and Place/Feeders
Siemens HS60 parameters Placement head type: 12-nozzle collection and placement head Number of cantilevers: 4 Theoretical mounting rate: 60000cph Component range: 0.6mm x 0.3mm (0201) to 18.7mm x 18.7mm The highest placement accuracy (4 sigma):
Used SMT Equipment | Pick and Place/Feeders
Vintage: 11/2014 (DTF Vintage 2011) Software Release: 8.5.5.4 Details: • Single Beam • (2) Heads: InLine 7 & Inline 4 • Spindles (7) Head 1 / (4) Head 2 • Nozzle Changers: 1 x 70 and 1 x 7 &n
Used SMT Equipment | Pick and Place/Feeders
Vintage: 07/2011 (DTF Vintage 2010) Software Release: 8.5.5.4 Details: • Single Beam • (2) Heads: InLine 7 & Inline 4 • Spindles (7) Head 1 / (4) Head 2 • Nozzle Changers: 1 x 70 and 1 x 7 &n
Used SMT Equipment | Pick and Place/Feeders
SM321S 1608CHIP: 21K CPH(IPC) 1005CHIP: 20K CPH(IPC) SOP16: 15K CPH(IPC)/feeder QFP100: 5.5K CPH(IPC)/pallet The placement accuracy of Samsung SM321: CHIP: ±50µm (0402@3σ) QFP: ±30µm (QFP168@3σ) The PCB b
Used SMT Equipment | Pick and Place/Feeders
SM321S 1608CHIP: 21K CPH(IPC) 1005CHIP: 20K CPH(IPC) SOP16: 15K CPH(IPC)/feeder QFP100: 5.5K CPH(IPC)/pallet The placement accuracy of Samsung SM321: CHIP: ±50µm (0402@3σ) QFP: ±30µm (QFP168@3σ) The PCB b
Used SMT Equipment | Soldering - Reflow
Gen5 Waterless Cooling and Flux Separation System – Heated Cooling Module in 1st Cooling Zone for Controlling Cooling Slope – Enhanced Waterless Cooling Modules for Low Product Exit Temperature. Complete Computer Control System including: Flat Panel
Used SMT Equipment | Pick and Place/Feeders
CM88S-M 1. Theoretical speed: 0.085 seconds/point 2. Feeder configuration: 30 pieces 3. Equipment year: 2003 4. Available patch range: 0201,0402; 0603; 0805; 1206; MELF diode; Transistor, 32mQFP, SOP, SOJ, LED: 3528, 3014, 50, 5730. 5. Patch a
