Electronics Forum | Tue Jan 28 10:28:28 EST 2020 | tamasmagyar
Hello there, I am wondering if there is any other way to program Mycronic MY600 jet printer beside I do with Aegis Factory Logix. The issue that I encounter most of times is that the compiler and the software on its own keeps crashing. Other thing
Electronics Forum | Tue Oct 31 20:42:56 EST 2000 | speedy-tech
Now we are face with tombstoning for component '0402',we have tried many ways,it seems no change,Below is our experient: 1,The thickness of stencil is 0.12mm,and the aperture is circle.the diameter is 0.55mm.The pads size is 0.5*0.6. 2 Ch
Electronics Forum | Wed Aug 21 17:50:05 EDT 2002 | davef
First, it�s GREAT that your defect rate of 282 is very close to your Boss� goal of 50 ppm. Second, your Cpk and your ppm numbers don�t tie out with our expectations. You say Cpk for: * mounter is 1.0 and �your mounting is 83ppm�. * printing is 1.33
Electronics Forum | Thu Aug 09 15:25:52 EDT 2001 | neil
Your right Dave. The system is set up correctly but sometimes there is a problem deleting messages with attachments. This problem was exacerbated by the scam32 virus. We set up Norton AntiVirus to quarantine these attachments and when you try to dele
Electronics Forum | Tue May 28 17:50:20 EDT 2002 | myu
Hi, Everybody! I'm looking for a High-Temperature Solder Paste / wire: "Pb93WROL140.71454";or "00Z890"; J-STD-006 Solder Alloys Sn05Pb93Ag02B Sn% Pb% Ag% Solid C Liq C Solid F Liq F 5.0 92.5 2.5 280 284 536 543 It should meet IPC/J-ST
Electronics Forum | Thu Feb 27 12:27:10 EST 2003 | stevel
Hi all, We got some bare pwb in our incoming inspecion looked really wrapped. The maximum twist of the pwb we messured is 0.056inch by following the method in IPC-TM-650 2.4.22 C. (The diagonal size of our pwb is 7.5inch) According to the IPC standa
Electronics Forum | Wed Apr 23 13:43:15 EDT 2003 | testing
Hi, This is a question for those of you who actually assemble components onto a board. Any idea what the "industry standard" is for the necessary First Time Pass Rate of products I should aim to? On pre-tested assemblies, should you expect to find
Electronics Forum | Fri Dec 01 06:31:53 EST 2006 | CHITRA K
We use SMBJ5.0A - D0214A package component in our products.During production recently we have identified a seroius problem. The problem is, After reflow soldering the impedance becomes more / lesser and due to which the product does not work since th
Electronics Forum | Wed Jan 21 04:14:19 EST 2009 | sachu_70
Hi Adam, I would suggest you refer IPC-2221 guidelines which define plating thickness as: Nickel 2.5-5.0 um , Gold 0.08-0.23 um. Although ENIG is a standard process, there is an associated risk towards Gold embrittlement, Porous Gold, or Black pad de
Electronics Forum | Thu Nov 07 16:02:06 EST 2019 | kylehunter
OK, got a lot of information today doing some testing.. Version number:- 07 SP11 (985 B02) Released Dec 8 2006 I did the tool(less) calibration of the squeegee height, which worked fine, no error. Did a test print, as you can see from the image, t
