Electronics Forum: 7351 (Page 3 of 5)

Electromigration Testing

Electronics Forum | Tue Aug 31 15:43:41 EDT 2004 | davef

You�re asking the wrong person to give remedial math lessons. Anyhow, here we go: * [1.56 microgram NaCl/cm^2]*[2.54 cm/in]*[2.54 cm/in] = 10.06 microgram NaCl/in^2 * [Omegameter] / [MIL-P-28809 Beckman / Markson] = [10.06 microgram NaCl/in^2] / [GS

QFN aligment issues

Electronics Forum | Mon Jul 02 14:29:41 EDT 2012 | markhoch

I disagree with the statement that using pads as fiducials shouldn't be a problem. If he's using pads on the PCB, than he is most likely using corresponding apertures on the stencil. During production, these apertures will start to have paste accumul

Standard for automated placement & assembly, density etc.

Electronics Forum | Sat Feb 18 09:20:09 EST 2012 | davef

The 3-Tier PCB library concept was originally created by IEC (International Electromechanical Commission) in 1999 and introduced to IPC in 2000. The concept had to be created as a solution for high density packaging for hand held devices to ruggedize

Electromigration Testing

Electronics Forum | Sun Jun 27 10:48:46 EDT 2004 | crios

I am a Quality Engineer which went from an Automotive QS9000 company manufacturing ceramic hybrid boards and now I am with a ISO PC mfg. company dealing with PCBA boards. I've been assigned a task in determining the contributing factor to high contam

Electromigration Testing

Electronics Forum | Wed Jun 30 18:12:59 EDT 2004 | crios

Thanks for the information. davef, I will search for and review the Ion Chromatography for Ionic Cleanliness test method. This definitely is the test I want to perform. Do you know what the IPC specification is using this test method? The outside

BGA pad size

Electronics Forum | Thu Jun 16 18:16:32 EDT 2005 | davef

Josh: You're correct it's tough to describe the layout of the BGA pads and traces. We wouldn't be too excited about seeing this board either. On one hand, for the obvious lack of care taken in doing the layout, this is a junk board and you shouldn

Question about pad pullbacks

Electronics Forum | Mon Dec 18 11:17:52 EST 2006 | mashmo

I am always looking for ways to make my boards more reliable and easier to fabricate and assemble. I have been baselining my footprints off of IPC-7351 and with the latest revision of the calculator they have started a new feature. Normally on say

0402 pad and stencil aperture design

Electronics Forum | Thu Oct 30 15:07:40 EDT 2008 | jemills

Hello I have a new 0402 pad design on a recent board were building in future. On closer look i thought the pad was a thru hole mount , but upon closer inspection the round pads are for 0402 comps. I had a discussion with the engineer and he said

SMT Design: Package distance and stand-off height

Electronics Forum | Fri Nov 14 03:41:26 EST 2008 | kywl

For your pad layout and spacing between > components, look here: _a class=roll > href="http://portal.ipc.org/Purchase/ProductDetail > .aspx?Product_code=77b562c1-b8f8-db11-8a6a-0050568 > 75b22" > target="_blank"_http://portal.ipc.org/Purchase/Pr

ReFlow Vs Wave (using Red Glue) Soldering.

Electronics Forum | Thu May 26 11:21:14 EDT 2011 | asksmt

Hello Guru's, I am using IPC-7351 LP Calulator to design Footprint (0603, 0805, 1206, SOT-23, etc) for all SMT Parts. Our Production Recently commented that they have included Red Glue Machine inhouse and will use Wave Soldering for Both Thru-hol


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