Electronics Forum | Mon Apr 23 14:03:18 EDT 2001 | Ryan Jennens
Dougie- We,too, have the IPC-A-600F, and the spec. refers to IPC-TM-650 test method in the back of the book. Look on page Number 2.4.22 of the test methods appendix. This outlines the procedure for determining the percentage of bow and twist,
Electronics Forum | Mon Jun 11 10:41:16 EDT 2001 | techment
Can someone helps to interpret the IPC-A-610's requirement on solder balls ( less than 5 mils in diameters.). We found about 6 to 10 balls ( less than 5 mils ) scattered in a 600 sq mm board. Is it consider failing for class 2 product ?. Thank you.
Electronics Forum | Mon Jun 12 18:44:30 EDT 2006 | muse95
OK, Pete, I just looked all through IPC-A-600G. Saw no mention of scoring anywhere. Please provide specific section number info. Thanks By the way, Chris, thank you for the information - that is really interesting stuff. Would you be willing to a
Electronics Forum | Tue Aug 10 09:01:18 EDT 2010 | davef
No, warpage tells you that design and/or fabrication process and/or assembly process need[s] to be corrected. Here's a link to a recent thread on SMTnet that seems to answer some of your questions: http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Mess
Electronics Forum | Tue Apr 23 15:35:45 EDT 2013 | dyoungquist
Check out IPC-A-600. Revision G (July 2004) section 3.2.3 (surface) and section 3.2.4 (internal) give min/max thicknesses for various weight copper. The min also changes depending on what class (1-3) standard you are working to.
Electronics Forum | Thu Aug 09 07:53:16 EDT 2012 | davef
Allowable bow & twist: Together, both IPC-A-600G and IPC-6012B represent the core IPC documents for describing the acceptable and nonconforming conditions that are either externally or internally visible on finished printed boards. IPC-A-600G relies
Electronics Forum | Thu Jan 14 09:25:34 EST 2016 | davef
IPC-A-610F 10.2.6 Laminate Conditions - Depanelization talks to the acceptability of the depanelization criteria for assembled boards. There is no requirement for moisture sealing with epoxy or other material. Basically, the standard requires that th
Electronics Forum | Tue Nov 11 17:35:08 EST 2008 | davef
SM-840, is a material qualification document only, with all the test requirements applicable only to a defined test coupon, not to production boards. So, it's useless for what you're trying to accomplish. As assemblers use A-610 - Acceptability Of E
Electronics Forum | Tue Mar 14 21:22:41 EST 2000 | Dave F
Bingo!!! By panelizing and adding breakaway rails (as Nancy says), Stuart can pour copper up to his board fab's tolerance from the board edge. Traditionally, he just wants to make sure no copper shows on the edge of the board. Then again, it's his
Electronics Forum | Thu Jun 01 21:54:00 EDT 2000 | Dave F
Jeremy: Standards: � A-600 talks about percentage of solder mask loss allowed, according to the location (eg, laminate, bare copper, gold or nickel, melting metals) and equipment class. � A-610 talks to "Solder Resist Coating - Voids & Blisters" by
