Electronics Forum | Sat Jan 08 06:46:33 EST 2022 | jineshjpr
Hi anyone knows what is the minimum copper foil thickness available across the industries to make PCB surface. Intention is to achieve 23 microns of finished copper thickness in a 0.3mm thickness PCB. Ideally if 3 microns plates are available, additi
Electronics Forum | Wed Jul 14 15:36:34 EDT 2010 | remullis
98% to 99% pass yield should be your target. The previous company I worked for, we were able to meet these goals with most all of our products. It took us some years to achieve this level of pass rate. Of course analyzing and good reporting from some
Electronics Forum | Mon Apr 30 13:45:11 EDT 2012 | rway
JimnHky is pretty much spot on. We have a high mix low volume line of products (most anyways). We have experimented with lean quite a bit, and have achieved single piece flow on our most voluminous product. In fact, this is where I would recommend
Electronics Forum | Wed May 15 05:44:04 EDT 2019 | peterchan
1、YSVJ-650B three-group multi- blades cutting machine, multiple sets of tools run at the same time, split the whole piece at one time, greatly improve production efficiency; multiple sets of tool design ensure that the split plate effect is not defor
Electronics Forum | Thu Oct 04 15:08:10 EDT 2001 | steve_
Hello everyone! Can somebody explain the advantages/disadvantages of a conveyer type reflow oven VS a batch oven. In conveyer type ovens, is the belt(conveyer) moving at a constant rate? If I have board that requires 20 seconds in pre-heat, 60 sec
Electronics Forum | Tue Oct 21 23:28:59 EDT 2003 | xz xiao
We all know the Lead Free process is trend, so we trial run it, now it is only my comment that we have a good achievement after several tries,we have taken serveral photos about Lead Free process with ErsaScope. 1.The surface of the solder joint are
Electronics Forum | Tue Oct 21 23:29:08 EDT 2003 | xz xiao
We all know the Lead Free process is trend, so we trial run it, now it is only my comment that we have a good achievement after several tries,we have taken serveral photos about Lead Free process with ErsaScope. 1.The surface of the solder joint are
Electronics Forum | Thu Jun 03 13:11:02 EDT 2004 | Scott B
We had an existing Mydata MY15 line and inherited 2 Quad lines (QSP2 and QSX1). We eventually had to get rid of the 2 Quads (major software and hardware issues) and have replaced these two machines with an addition single Mydata MY15 and are getting
Electronics Forum | Thu Dec 29 22:19:36 EST 2005 | Joseph
We have tested SN100C for LF wave soldering process since August'05 and currently start production for a month ago. Initially we use SAC305, but due to the shrinkage cavities (micro-crack) we changeover to SN100C. In summary, SN100C did perform well
Electronics Forum | Tue May 10 15:57:43 EDT 2011 | jamike
Hi I am responsible for the whole of production and test and have been given the job by my manager to get accurate job times on all assemblies timing various staff. I have 18 years experience working in all areas of production and test so I know the
