Electronics Forum | Fri Mar 04 00:46:36 EST 2011 | kemasta
Hi ScottE "Is this ball sitting on a via?" I am not sure is I answered your question correct, the ball is sit on the pad.
Electronics Forum | Wed Mar 09 17:01:10 EST 2011 | davef
We don't think your voiding is related to your bridging. We'd guess: * Voiding is either poor material selection or improper process recipe choice * Bridging is sloppy process management
Electronics Forum | Tue Feb 25 11:56:33 EST 2020 | slthomas
I think I'd opt for a stencil with everything already cut and then tape it if that didn't screw up your stencil gasketing. Then you just have to define the process for adding the optional parts and you can decide to use those apertures or not.
Electronics Forum | Thu Mar 03 02:00:37 EST 2011 | kemasta
I tried, but error:- Attribute validation error for tag CFFILE. The value of the attribute destination, which is currently /var/www/smtnet/Forums/Attachments//, is invalid. The error occurred on line 12. Try go to this url and view:- http://img845.
Electronics Forum | Mon Mar 21 17:36:44 EDT 2011 | davef
Kim: You could be correct. We had a batch of BGA that had a weird bridging pattern. Could not figure it out. So, we put the whole batch straight out of the 'box' bug-up on a hot plate and video recorded the balls as we took them through a thermal cy
Electronics Forum | Thu Jun 08 01:46:00 EDT 2023 | camilleyang3
To prevent BGA (Ball Grid Array) issues related to SMT (Surface Mount Technology) solder resist when fabricating a PCBA (Printed Circuit Board Assembly), you can follow these guidelines: Design considerations: Ensure proper spacing between BGA pads
Electronics Forum | Wed Jun 14 12:49:12 EDT 2023 | spoiltforchoice
#talkingwithrobots
Electronics Forum | Thu Jun 15 00:43:58 EDT 2023 | frankchan
Hahaha, that's straight to the point
Electronics Forum | Fri Mar 04 01:08:19 EST 2011 | kemasta
Thanks davef Bridging:- There is no heat sink on the BGA, the heat sink will be fix after relow. I do believe paste had something to do with it, but currently this defect didn't appear so oftenly, so we think that the main root cause is not from the
Electronics Forum | Mon Mar 21 02:54:58 EDT 2011 | kemasta
Hi Dave I agree with the 2nd point (sloppy process management) if the failure rate is higher than 5%. But this is 0.083% case, and only happen once in the blue moon. As I study about the re-flow profile for the last whole week, current parameter se
