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MYDATA has qualified solder paste from Alpha and AIM for Jet Printing

Industry News | 2009-09-26 16:26:35.0

MYDATA announces that the two leading solder paste partners, Alpha and AIM, releases solder paste designed and qualified for the MYDATA MY500 Jet Printer.

Mycronic Technologies AB

How much time can you save in your SMT production?

Industry News | 2009-11-11 12:57:53.0

At Productronica 2009 MYDATA shows SMT manufacturers how to save substantial time in production with MYDATA solutions - specifically designed with lean manufacturing in mind. With unique machine concepts and advanced software tools MYDATA presents the intelligent factory of the future.

Mycronic Technologies AB

MYDATA ANNOUNCES FIRST STENCIL-FREE SOLDER PASTE PRINTER

Industry News | 2005-10-03 14:38:41.0

STOCKHOLM, SWEDEN (September 13, 2005)

Mycronic Technologies AB

Flux splatter issues

Electronics Forum | Fri Feb 05 04:14:43 EST 2016 | grahamcooper22

HI Greg, you may want to consider trying a paste especially developed to minimise splattering. I work for Almit and we offer a paste called SPM ( SPlatter Minimiser)...it is widely used for applications where no splattering is required. Take a look a

Lead Free Solder Paste Evaluation

Electronics Forum | Wed Apr 08 07:16:21 EDT 2009 | arrowvale

We have just switched to Almit (www.almit.com)LFM48 W TM-HP-S lead free solder paste. In general terms it is an easy printing paste, with great slump properties, wide reflow process window and offers excellent solderability on all pcb / component pa

Alternative tin-lead solder pastes to minimize poor wetting on o

Electronics Forum | Fri Mar 23 03:41:19 EDT 2012 | grahamcooper22

try Almit Sn62 HM1 RMA V14L ....its the best no clean lead paste for wetting...I sell it and it has solved wetting problems many times when users have used other pastes

Solder Splash/Balls and Flux Splash/Balls

Electronics Forum | Tue Jan 19 10:18:58 EST 2021 | grahamcooper22

Hi, try a low spitting cored wire...something like ALMIT SR-LA cored wire...or SR-LA SUPER...it eliminates flux/solder spitting during soldering.

Voiding in LGA (LT) soldering

Electronics Forum | Mon Aug 30 06:47:18 EDT 2010 | arjan

We having issues installing the Linear Tech LTM8023. We have different soldering results in our PBfree testruns. The voiding and solderball rate is not stable (random positions and sizes). The pcb's (gold finish)are prebaked, the LGA's are stored in

OSP Finish-Lead Free Solder Paste

Electronics Forum | Wed Jul 19 10:57:25 EDT 2006 | Rob

Depends on a number of things - such as type of oven, type of components, if you are washing the boards or not, etc. Assuming nothing special, no clean, I would try the following (in that order): Koki: S3X58-M406L Almit: LFM-48 Indium: 5.1 Cheers,

Blistering issue, mixed LF/SnPb process

Electronics Forum | Fri Jul 28 09:12:59 EDT 2006 | pavel_murtishev

Good afternoon, Profile is standard ramp-soak-spike (According to paste manufacturer requirements), paste is Almit V16L HM1-RMA, type 3, Sn62Ag2. Look here for details: http://www.yousendit.com/transfer.php?action=download&ufid=98684D1201B0F001


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