Electronics Forum | Tue Mar 15 09:32:49 EST 2005 | Sandy Kelley
I have been engaged to find an Applications Engineer for an electronic materials division of a worldwide multi-billion dollar diversified international specialty chemical endeavor. My client is a well respected, cutting edge technology leader in un
Electronics Forum | Tue Mar 15 09:34:31 EST 2005 | Sandy Kelley
I have been engaged to find an Applications Engineer for an electronic materials division of a worldwide multi-billion dollar diversified international specialty chemical endeavor. My client is a well respected, cutting edge technology leader in un
Electronics Forum | Tue Jun 02 21:27:22 EDT 2009 | davef
We've never heard of a situtation where oversized pads caused voiding. Your supplier is correct that the pads on the board should be the same size as the pads on the interposer, but this is to improve reliability issues. Search the fine SMTnet Archi
Electronics Forum | Mon Mar 30 16:02:44 EST 1998 | Michael Allen
| We have successfully put .016" vias in .030" pads. | There is no issue with .030" solder balls, since | the actual volume of the .002" via in pad is small | compared to the ball+solder paste volume. | We did notice random bubbles where, apparentl
Electronics Forum | Sat Jun 28 08:17:21 EDT 2003 | davef
We form a barrier to contain the dye, but regardless it is messy. Actually, we no longer use dye, per say. We use the stuff machinists use for staining metal. Look here for hints: * http://www.ivf.se/Elektronik/dye_penetrant/edefault.htm * http:
Electronics Forum | Tue May 17 08:00:26 EDT 2005 | Bob R.
We went through this with one PBGA supplier recently and they were able to get the problem under control by fixing some of their molding processes that were inducing residual stresses. You can really see it in a thermal moire where you measure warpa
Electronics Forum | Mon Jan 16 16:19:22 EST 2006 | davef
Dunno. 4% higher standoff results in 16% higher reliability [�The Effects of Solder Joint Voiding on Plastic Ball Grid Array Reliability� Banks, Donald R., et al.; Proceedings of the Technical Program - Surface Mount International; September 10-12,
Electronics Forum | Wed May 24 17:49:51 EDT 2000 | Keith Luke
SMTneters, The end of May finds several recent publications from leading publishers on my desk. I am all too happy to share these books with our loyal SMTneters in the hopes that they will provide us with a timely review of the new release. For ma
