Electronics Forum | Tue Apr 03 01:37:54 EDT 2001 | philipreyes
60% 36% 0f ball area >36% Class2 Accept Reject 45% of ball diameter >45% 20.25% of ball area >20.25% Class3 Accept
Electronics Forum | Fri Jan 08 04:58:07 EST 1999 | Scott B
Can anyone direct me to any literature (preferably on-line) relating to current SMT packaging usage worldwide and any trends therein. Thanks... Scott
Electronics Forum | Thu Feb 16 12:41:50 EST 2006 | fredericksr
Hey folks, I was interested in any information that you might have on tombstone reduction when using a lead free solder and profile. Thanks for any input that you may have! -Russ #x
Electronics Forum | Mon Apr 17 16:22:29 EDT 2006 | jaimebc
Are there any users currently working with Unicam and Universal HSP and GSM? If so, what offline interface are you using? USOS or UCT-52. Was there any conflict between Universal's interface and Unicam? Thanks
Electronics Forum | Fri Feb 16 07:55:37 EST 2007 | ronsou
Anyone have any experiance with these Juki machines? I have no experiance with Juki except for a Zevatech place-mat 360 many years ago. Currently using Siemens and Mydata. How is the accuracy, speed, durability, and programming. Any help would be a
Electronics Forum | Tue Sep 23 10:22:40 EDT 2008 | kumaravelu
Is there any specific method or product available to implement FIFO system. Currently we stack all the D/C in a shelf and we don't have a method to pull the latest D/D first. I would appreciate any help in this regard. Sundaram
Electronics Forum | Thu Sep 11 09:22:27 EDT 2003 | swagner
Is there any conceivable way this could cause a tombstoned device?
Electronics Forum | Thu Aug 17 18:03:51 EDT 2006 | Nirmal
Dear Sir, Any buddy can explain what is different with PBGA and CBGA..
Electronics Forum | Wed May 14 11:10:56 EDT 2008 | scottefiske
Anyone out there in SMT land know the premium you will pay by not accepting any X outs?
Electronics Forum | Tue Mar 19 17:30:46 EST 2002 | rculpepp
Does anyone have or know of any published guidelines for BGA layout on PWB's so that they can be tested. Specifically using micro vias? If anyone has any input regarding other test considerations for BGA devices I'd like to hear from you as well. W
