Electronics Forum | Sun Jul 26 06:31:07 EDT 2009 | hohk
Hi everyone, I need to connect a cylindrical disc device (piezo ceramic sensor) to the PCB trace without using high temp solder. I plan to use "3M™ XYZ-Axis Electrically Conductive Adhesive Transfer Tape 9719" to connect the device to the PCB trace
Electronics Forum | Sat Aug 01 04:45:43 EDT 2009 | hohk
Thanks on the advice isd.jwendell! Yes, the piezo ceramic has a Curie Temp of about 800C, so its safe operating temp should be around 300-400C. How about if my PCB is a prototype, would it be more economical to use hand soldering or just manually app
Electronics Forum | Sat Aug 01 22:29:14 EDT 2009 | hohk
Here's the link to the image. It seems the forum's image feature is down? X-section view.. http://i672.photobucket.com/albums/vv88/hohk/X-sectionView.jpg Copper Strip with Adhesive Tape idea... http://i672.photobucket.com/albums/vv88/hohk/CoperStri
Electronics Forum | Sun Aug 02 19:47:16 EDT 2009 | isd_jwendell
Now that I've seen the pics... Soldering could work just fine. If you are going for large production then you could get copper discs cut and mounted in tape carrier ($$). This would make it very easy for automated equipment to assemble. Mounting a
Electronics Forum | Tue Jul 28 20:11:14 EDT 2009 | hohk
Thanks Davef! 3M's product description of "3M™ XYZ-Axis Electrically Conductive Adhesive Transfer Tape 9719 is suitable for attaching low surface energy (LSE) EMI shields to electronic and electrical devices where high temperature (up to 400C) is re
Electronics Forum | Sat Aug 01 12:06:52 EDT 2009 | isd_jwendell
Unfortunately, I don't see any image. If your part will survive 300C then even convection reflow should work. The use of paste and reflow ovens are for when you move to production quantities. It sounds like you could hand solder your prototypes (proo
Electronics Forum | Fri May 30 04:20:59 EDT 2003 | Ben
Hi all I am facing the problem with reoworking CSP component for high frequency application boards. Our customer do not allow us to use tacky fluxes due to high frequency application and component has low standoff ,and the ball pad and ball size is
Electronics Forum | Tue Aug 30 10:46:27 EDT 2005 | lyrtech
Hi, I curently have an interesting challenge. But I don't have all the knowledge to solve it. One of our boards is used in RF applications. We noticed that the No-Clean flux residue makes interferences in the RF signal. Removing the flux residue so
Electronics Forum | Sat Feb 03 13:33:30 EST 2007 | Scotty
Anyone out there in the Cyber SMT world have success/experience utilizing conductive adhesives as a substitute for typical eutectic alloys? Application is for a Single sided SMT Process. With a reliability life span of 8 hours. Forum feedback could
Electronics Forum | Mon Jul 08 03:09:12 EDT 2002 | Benny
Hi all How can I find the technical paper or source of information about using No-clean flux with high frequency apllication. High frequency mean more than 2 GHz - 5 GHz. I heard from my colleague that No-clean flux residue on board effect to high
