Electronics Forum | Thu Aug 01 07:06:28 EDT 2002 | gdstanton
Just exploring options to improve wetting. It turns out our facilities dept is looking at an N2 generator to supply dry boxes. Thought it might be a good idea to assess whether we should expand the project to include reflow.
Electronics Forum | Tue Feb 11 15:54:23 EST 2003 | Jodi Roepsch
I am interested in knowing if anyone has new information about the black pad defect with ENIG plating. I am interested in it from the viewpoint of risk assessment, testing done on final product to isolate failures,and root cause of the defect. Than
Electronics Forum | Wed Jun 18 11:05:26 EDT 2003 | Quantass
cal, hahahahaha. "40,000ft overview". Indeed! Thanks for the lead. I intentionally left out details such as $$$$ in hopes of obtaining a broad list of suggestions. From there I can better assess what to focus in on.
Electronics Forum | Tue Jul 22 03:56:24 EDT 2003 | A.G.
Are there existing acceptability dedicated criteria for ALIVH bare boards? (Equivalent to IPC-A-600) In particular, how can we assess copper foil cracking after thermal stress?
Electronics Forum | Fri Aug 15 09:48:10 EDT 2003 | davef
First, what do you mean by "mishandled OSP" boards? Second, we don't like to bake our OSP boards, because of the potential to degrade the coating. Why do you want to bake these boards? Third, why not paste-up a board, reflow it, and assess the sol
Electronics Forum | Wed Jan 28 16:42:21 EST 2004 | davef
Consider what you are trying to assess. Any product with one or more defects will cost you money. Your supplier should be using: 9261 - In-Process DPMO and Estimated Yield for Printed Board Assemblies You should be using: 7912 - Calculation of DPM
Electronics Forum | Tue Sep 07 16:58:16 EDT 2004 | davef
Au contraire, mon ami. Although there is not "BGA" solderability test specified in J-STD-002A, the Test S can be used to assess solderability on BGA packages. [Joint Soldering Technology Committee ]
Electronics Forum | Wed Jul 20 08:30:21 EDT 2005 | davef
Most of these chemical swabs were developed to assess solder used in water supply piping. So, they are a really broad, gross test. If they tell you there's lead, there's probably lead, otherwise you're just guessing.
Electronics Forum | Wed Aug 03 14:11:03 EDT 2005 | mgc
This problem is not unique to China. Second user customers are always challenged to assess machine condition, upgradeability, service history etc. More often then not, candidate machines are located halfway around the world. Further complicating thi
Electronics Forum | Wed Mar 29 22:10:59 EST 2006 | davef
Kevslatvin When you visit the machine suppliers, why don't you time the setup of your 25 reels of components as part of your assessment?
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