Electronics Forum | Thu Feb 07 09:07:10 EST 2002 | fmonette
Dason, Please be aware that weight gain is only a very crude estimate of the component moisture content. This is only accurate when the moisture is uniformly distributed inside the component (which is actually never). This measurement is usually no
Electronics Forum | Sat Mar 06 22:50:48 EST 2004 | pari
Hi, can somebody please educate 1. What is the baking temperature and time before reworking a faulty board that is received from the field. 2. What specs that specifys this baking temp and time? Thanks
Electronics Forum | Fri Aug 12 22:10:24 EDT 2005 | Mika
I agree with all the prior postings! But I have some additional thoughts about this. If there is a build up of moistures (% humidity) inside the pcb; before you reflow the pcba; then you will have the result out of the oven, just as you described. My
Electronics Forum | Fri Aug 12 03:54:03 EDT 2005 | Mika
Does the pcba:s comes directly from the assembly line, You are going to do rework on? If faulty pcba:s comes back from, let say a customer from outside or the pcba:s has been on Your shelf for some days/weeks, exposed to open environment (humidity in
Electronics Forum | Wed Aug 11 06:27:07 EDT 2021 | danisa
Hi all, The PCBA was swollen after SMD It is hard PCBA with 6 layers and SMD both sides Defect rate: ~ 5% Phenomenon: swell at the same side, same position (at 2 IC positions). Did not find any abnormality in SMD process as well as storage condition.
Electronics Forum | Thu Mar 03 14:01:16 EST 2022 | chris007
Hello Baking before solder pasting and reflow actually due to poential moisture development. This is JDEC requirement I believe to do so. We AOI after cleaning so we AOI a clean PCBA
Electronics Forum | Tue Apr 19 17:34:34 EDT 2022 | dwl
Be careful of MSL level 4 or higher devices on the first side. if they sit out 3 days, they will need to be baked before second side reflow or you risk component damage.
Electronics Forum | Wed Dec 19 01:17:13 EST 2001 | ianchan
Hi Experts, I need help here, advice appreciated from all... Production is running a Lot of flex-circuit PCB, through the SMT line, with 0402 components. The flex-PCB is taped to FR4 support "pallets" when processing thru' the SMT P&P m/c. We use
Electronics Forum | Thu Apr 14 17:24:06 EDT 2022 | cbart
depends on board finish and PCB substrate materials. If you were using OSP or silver finished bare boards the time to process is less than an ENIG or HASL finished. certain substrate material absorb more moisture than others or at a quicker rate. so
Electronics Forum | Sun Jul 15 20:10:09 EDT 2001 | Danial
What is the best method to repair Warped PCBA. Obviuosly twisting it back to make it flat would be a disasterous. The method that I've tried wold be mounting the assembled board to the flat holder with the clamp and bake them at 120 Deg C for about 4
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