Electronics Forum | Fri Aug 19 08:41:04 EDT 2005 | davef
If these are these bare [or partially assembled] boards, baking probably will not hurt, as long as the bake is not excessive. If these are these assembled boards, baking probably will not accomplish much. What is the source of this water? If it's
Electronics Forum | Thu Oct 26 12:27:40 EDT 2000 | Dave Cunningham
What guidelines would you suggest for an assembly house concerning the baking of bare PCB's (assume FR4) and flexes/rigid-flexes before assembly.
Electronics Forum | Fri Nov 05 14:47:35 EST 1999 | Russ Cutler
We recently came to a cross roads... We have historically baked out ALL of our circuit cards, with a 2 fold purpose 1) to dry the part marking ink, and 2) to eliminate any moisture, which could result in measling further in the process of assembly.
Electronics Forum | Fri Nov 05 21:22:34 EST 1999 | chartrain
Amazing in today's technology that people still bake because "that's the way we've alawys done it". Baking is a band aid for poor manufacturing of the PCB. Moisture can become trapped between the layers during buildup. This moisture when it contacts
Electronics Forum | Tue Jun 13 17:06:33 EDT 2000 | Jeff Tamagi
Someone was telling me that there was a requirement to bake / dry bare boards prior to reflowing? Where can I obtain information on this?
Electronics Forum | Wed Apr 24 21:35:34 EDT 2002 | davef
Ooooo, much better. Tough to say, because of all the variables [ie, different materials, moisture level, temperature, etc]. Plastic encapsulated devices, especially IC, absorb water from the air, which is violently released during soldering. Typica
Electronics Forum | Tue Sep 05 11:18:54 EDT 2000 | Chris May
Pascal, Hopefully, the system that you invest in will have a programmable drying cycle as one of its features. As far as humidity content is concerned, I am sure that some more learned colleagues may be able to help you. Although, I believe some p
Electronics Forum | Tue Oct 27 16:22:00 EDT 2009 | davef
It's not the first thing we think of in looking at your picture. First off, the lack of copper in the region of the red oval makes us think of a plating defect. We don't expect that moisture out-gassing through the barrel wall to show-up on opposite
Electronics Forum | Fri May 31 10:35:46 EDT 2002 | dason_c
I think that the IPC spec only apply to the MSD. I had a paper from Lucent and forwarded by Francois Monette, please aware that the first 2 hours, the moisture doesn't bake out from the assembly/component and result show that it is increase the weigh
Electronics Forum | Sat Dec 19 16:54:43 EST 2009 | edmentzer
We use WSM-90 which is a red water wash off solder mask from Contronic Devices, Huntington Beach, CA, 714-897-2266. We bake the bare board at 150 F for 30 minutes after applying the mask. We run 130 to 140 F DI water in the inline cleaner which rem
