Electronics Forum | Fri Aug 27 10:25:52 EDT 1999 | Matthew Park
Is it feasible to have one type of board carriers to take boards thru 1) glue curing process for first side and 2)invert carriers with boards, and 3)reflowing second side, and 4) do manual stuffing of th components and 5) take them thru selective wav
Electronics Forum | Thu Jul 18 04:06:26 EDT 2019 | artem
Thanks for the info. And what about accuracy of the placement. Are both machines able to handle the same parts or are there any differences like for small components or BGA?
Electronics Forum | Mon Jul 15 09:41:11 EDT 2002 | soupatech
I am experimenting with 2 types, FG256 17x17mm and FG456 23x23mm both with a 1mm pitch and .5mm ball. They both have a full array. As for as the x-ray, we are looking into pruchasing some used equipment but will mostly send them out for testing until
Electronics Forum | Wed Aug 19 05:00:56 EDT 1998 | Tom Blum
Hi there, I'm actually facing a lot of trouble with PCB's presenting up to 3mm of bow /twist at reception i.e. before assembly. The PCB size is 220 by 230mm. The boards are to be assembeled SMD double sides with 05.mm pitch on both sides. In order to
Electronics Forum | Wed Feb 18 12:42:43 EST 2004 | babe
OK, if the sphere of the ball and the paste on the pad are both eutectic, 63/37 then the paste will reflow first causing a drop of the component, after which the spheres will reflow causing a double drop and a good intermettalic. You can see this by
Electronics Forum | Fri Sep 23 03:11:31 EDT 2005 | Base
Hi All, I think you're adressing this issue from the wrong angle: What I'm reading is an equipment vendor who has an idea about what the best way of working is (replace entire feeders), and a (potential) customer who thinks otherwise (splicing). The
Electronics Forum | Wed Aug 18 10:28:17 EDT 1999 | Carol Zhang
Hi, I'd like to ask some tips about the merits and shortcomings o of both screen printer and stencil printer. For small quantity and highly mixed usage, which type of printer is suitable to our application? The boards contain no BGA and the fines
Electronics Forum | Tue May 19 13:29:33 EDT 2015 | dyoungquist
We have been running a Heller 1707EXL for 8 years and added a Heller 1707MKIII about 1 years ago. We have not had any problems with either one of them. We do both lead and lead-free assemblies along with BGA/LGA components. If speed/volume is not
Electronics Forum | Wed Dec 22 12:36:36 EST 2004 | rlackey
Hi Mark, Look on the bright side, if you want to change from HASL you've got the lead free issue which will allow you to evaluate all other finishes, and find the best one for you. Dave, have you seen any unleaded HASL finishes & any issues arising
Electronics Forum | Fri Feb 27 11:33:32 EST 2004 | Bryan
Very strange question,but interesting.Is there anyone who have conducted any experiments to figure out the results?I made a profile board,one thermal couple on pad and other one drilled into the ball of BGA.the 2 points are perpendicular to conveyor
